Molded photosensitive assembly for array imaging module for electronic device and manufacturing method thereof

ABSTRACT

A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

CROSS REFERENCE OF RELATED APPLICATION

This is a Continuation application that claims the benefit of priorityunder 35U.S.C.§ 120 to a non-provisional application, application Ser.No. 15/784,167, field Oct. 15, 2017, which is a Continuation applicationthat claims the benefit of priority under 35U.S.C.§ 120 to anon-provisional application, application Ser. No. 15/317,117, filed Dec.8, 2016 and another non-provisional application, application Ser. No.15/473,573, filed Mar. 29, 2017, which is a Continuation applicationthat claims the benefit of priority under 35U.S.C.§ 120 to thenon-provisional application, application Ser. No. 15/317,117, filed Dec.8, 2016, the entire contents of each of which are expressly incorporatedherewith by reference.

NOTICE OF COPYRIGHT

A portion of the disclosure of this patent document contains materialwhich is subject to copyright protection. The copyright owner has noobjection to any reproduction by anyone of the patent disclosure, as itappears in the United States Patent and Trademark Office patent files orrecords, but otherwise reserves all copyright rights whatsoever.

BACKGROUND OF THE PRESENT INVENTION Field of Invention

The present invention relates to a camera module, and more particularlyto an array imaging module and its molded photosensitive assembly andmanufacturing method thereof for electronic device.

Description of Related Arts

Nowadays, most of the electronic products incorporate with an integratedcircuit board to provide multiple functions in one single electroniccomponent. In particular, it is noted that this integratedmulti-function crossovers between trends. For example, the circuit boardconfiguration of the mobile phone which is originally designed forcommunication purpose has been developed into a mobile electronic devicesuch as smart phone that integrally incorporates with the integratedcircuit to provide multiple functions of communication, image capturing,Internet-enabled access, navigation, and other functions. Therefore, theintegrated circuit board must provide all-in-one multifunction for thesmartphone.

Accordingly, most camera modules in the current mobile electronicdevices are single-lens modules. However, this single-lens camera modulecannot meet the requirements of high image quality and capturingeffectiveness in order to meet the requirement of multi-functionalapplication of the current mobile electronic devices.

An advanced camera module, such as a dual lens camera module, has beenalready used in the current mobile electronic device, wherein the duallens camera module is configured to simulate the human eye structure forimage capturing. In particular, the features and performances of thedual lens camera module, such as 3D capturing and scanning ability,gesture and location recognition, color fidelity (color accuracy orcolor balance), rapid focusing ability, panoramic shooting, backgroundfield of depth, and other aspects, are better than the features andperformances of the single lens camera module. Therefore, there is animportant development direction to include more than one lens cameramodule in the future camera industry. Accordingly, the dual lens cameramodule generally comprises two imaging modules, such that during the twoimaging capturing process of the dual lens camera module, two images arecaptured by the imaging modules respectively. Due to the positiondifference between the two imaging modules, the two images will have aspatial position difference. Then, the two images will be processed viaan imaging synthesis method to form a final captured image. It isimportant that the imaging modules must have the uniformity of imagingeffects, such as resolution, shading, color, and the deviation inhorizontal, vertical, and longitudinal directions, wherein theseindications are the major factors to determine the image quality of thedual lens camera module.

However, the current manufacturing and assembling technologies, and thestructure of the dual lens camera module cannot guarantee the imagingquality thereof. As shown in FIG. 1, the existing dual lens cameramodule comprises a circuit board 10P, two lens bases 20P, two imagingmodules 30P, and one supporting frame 40P, wherein a lens motor assembly31P is operatively connected to each of the imaging modules 30P.Accordingly, each of the lens bases 20P is discretely mounted on thecircuit board 10P at one side thereof in order to connect the lens bases20P with each other via the circuit board 10P. The lens motor assembly31P is coupled at and supported by the corresponding lens base 20P. Eachof the lens motor assemblies 31P is enveloped by the supporting frame40P. As shown in FIG. 1B, the two lens bases 20P can be integrated witheach other to form a single base of the dual lens camera moduleaccording to the existing technology. In other words, the lens motorassemblies 31P are mounted at different positions of the lens base 20P.It is appreciated that, through the existing assembling process of theexisting dual lens camera module, each of the lens bases 20P isindividually coupled at the circuit board 10P, such that the dimension,position, etc. . . . of each of the lens bases 20P is hard to control.In other words, the parameters, such as dimension and assemblingposition, of the dual lens camera modules are inconstant. According tothe existing dual lens camera module, as shown in FIG. 1A, the lensbases 20P are individual components and are electrically coupled to thecircuit board 10P in order to connect the lens bases 20P with eachother. Accordingly, the circuit board 10P is a PCB circuit board,wherein the rigidity of the circuit board 10P is relatively weak, suchthat the circuit board 10P is easy to be deformed or bent. As a result,the overall rigidity of the dual lens camera module is hard to controland ensure. After the dual lens camera module is assembled, there willbe a deviation between the two imaging modules 30P during the operationof the dual lens camera module. For example, the distance between thelens motor assemblies 31P cannot be ensured, the positioning toleranceof the lens motor assemblies 31P is relatively large, and the opticalaxis of each of the imaging modules 30P is easily deviated from itsoriginal preset position. Any one of these situations will affect theimage quality of the dual lens camera module. For example, theuncontrollable factors and adverse effects will affect the imagingsynthesis process to form the final captured image. In addition, sincethe lens motor assemblies 31P are wrapped within the supporting frame40P, it is necessary to apply adhesive to a gap between the lens motorassembly 31P and the supporting frame 40P. As a result, the overall sizeof the dual lens camera module will further be relatively increased.

Furthermore, the assembly of the dual lens camera module is based on theconventional COB (Chip On Board) assembling process. The circuit board10P generally comprises a circuit protrusion 11P and a photosensitivechip 12P electrically coupled on the circuit board 10P via a connectingwire such as gold wire 121P. Accordingly, the gold wire 121P has anarc-shape protruded from the board body of the circuit board, such thatthe circuit protrusion 11P and the gold wire 121P protruded from thecircuit board 10P will adversely affect the assembling process of thedual lens camera module.

Since the circuit protrusion 11P and the gold wire 121P are protrudedand exposed from the circuit board 10P, the assembling process will beunavoidably affect by these exposing components. For example, theadhering process of the lens base 20P and the welding process of thelens motor assembly 31P will be affected by the circuit protrusion 11Pand the gold wire 121P. Accordingly, welding resisting agent and dustmay be adhered to the lens base 20P during the welding process of thelens motor assembly 31P. Since the circuit protrusion 11P and thephotosensitive chip 12P are positioned to create a gap therebetween, thedust will be accumulated at the gap thereof. It will contaminate thephotosensitive chip 12P, such that the photosensitive chip 12P willproduce an undesirable result, such as black spots, to affect the imagequality.

Furthermore, the lens base 20P is located at an exterior side of thecircuit protrusion 11P. When the lens base 20P is mounted on the circuitboard 10P, a safety clearance must be provided between the lens base 20Pand the circuit protrusion 11P. In particular, the safety clearanceincludes a horizontal direction and the upward direction of the lensbase 20P with respect to the circuit board 10P. As a result, thethickness of the dual lens camera module will be substantiallyincreased. In other words, it is almost impossible to reduce the overallthickness of the dual lens camera module.

Also, comparing the molding of the dual lens camera module with themolding of the single lens camera module, the coordination of the duallens camera is higher than that of the single lens camera module. Forexample, the optical axes of the imaging modules are required beingcoincident and the optical axes of the lens through the conventional COBprocess must be consistent. Collectively, the overall size of the duallens camera is relatively large, the rigidity of the circuit board isrelatively weak, the flatness of the circuit board is relativelysensitive, and the thickness of the circuit board is relatively large.

SUMMARY OF THE PRESENT INVENTION

The invention is advantageous in that it provides an array imagingmodule and its molded photosensitive assembly and manufacturing methodfor electronic device, wherein the molded photosensitive assemblycomprises mold sealer and a photosensitive device, wherein thephotosensitive device comprises at least a circuit board and at leasttwo photosensitive units which are electrically connected to the circuitboard are sealed by the mold sealer to form an integrated structure.

Another advantage of the invention is to an array imaging module andmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the photosensitive units are electrically connected tothe circuit board via one or more lead wires, wherein the lead wires areenclosed and encapsulated by the mold sealer.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the mold sealer is extended from a non-photosensitivearea of the photosensitive unit and is inwardly extended towards thephotosensitive area of the photosensitive units, so as to minimize aperiphery size of the mold sealer.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the photosensitive device comprises at least anelectronic element protruded from the circuit board, wherein theelectronic element is enclosed by the mold sealer to prevent theexposure of the electronic element to outside.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the mold sealer comprises a light filter mountingportion to support a plurality of light filters without any additionalsupport.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the mold sealer has a plurality of inner indentationgrooves to engage with the photosensitive unit, such that a relativeheight difference between the circuit board and the photosensitive unitwill be reduced to minimize the height of the array imaging module.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the circuit board comprises a plurality of conductivechannels and a plurality of outer indention grooves correspondinglyformed therewith, such that the photosensitive unit can be coupled atthe rear side of the circuit board via a Flip Chip (FC) method.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the reinforcing layer is coupled at the bottom side ofthe circuit board not only to reinforce the strength of the circuitboard but also to enhance the heat dissipation of the circuit board.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the circuit board further comprises at least areinforcing slot thereon and the mold sealer is extended into thereinforcing slot to enhance the strength of the circuit board.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the mold sealer comprises a light filter mountingportion to support a plurality of light filters, so as to retain therespective light filters in position.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the molded photosensitive assembly comprises at least asupporting member biasing against the engaging surface of the upper moldbody during the molding process to protect the lead wires from beingdamaged or deformed.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein when the upper mold body and the lower mold body of themold are closed and engaged with each other during the molding process,the supporting member is upwardly extended to bias against the engagingsurface of the upper mold body to prevent the engaging surface of theupper mold body contacting with the lead wires so as to prevent thedeformation of the lead wires.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein when the upper mold body and the lower mold body of themold are closed and engaged with each other during the molding process,the supporting member provides a safety distance of the lead wires toprevent the engaging surface of the upper mold body pressing against thelead wires.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein when the upper mold body and the lower mold body of themold are closed and engaged with each other during the molding process,the supporting member will absorb the impact force of the engagingsurface of the upper mold body, so as to prevent the damage of thephotosensitive unit, the circuit board, and the lead wires.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein when the upper mold body and the lower mold body of themold are closed and engaged with each other during the molding process,the mold engaging surface of the upper mold body and the top side of thesupporting body are tightly engaged with each other in asurface-to-surface engaging manner to prevent the edge trimming of themold sealer, so as to enhance the imaging quality of the array imagingmodule.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein when the upper mold body and the lower mold body of themold are closed and engaged with each other, the mold engaging surfaceof the upper mold body and the top side of the supporting body aretightly engaged with each other to form a closed environment during themolding process, so as to prevent the mold material entering into theclosed environment to contaminate the photosensitive area of thephotosensitive unit.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the mold comprises an enclosing film provided at themold engaging surface of the upper mold body, wherein when the uppermold body and the lower mold body are coupled with each other, theenclosing film is sandwiched between the mold engaging surface of theupper mold body and the top side of the supporting body, so as toprevent the damage of the photosensitive unit, the circuit board, andthe lead wires.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein when the upper mold body and the lower mold body arecoupled with each other, the enclosing film is sandwiched between themold engaging surface of the upper mold body and the top side of thesupporting body, to form the photosensitive area of the photosensitiveunit in a closed environment so as to prevent the mold material enteringinto the closed environment to contaminate the photosensitive area ofthe photosensitive unit.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein when the mold engaging surface of the upper mold body isbiased against the top side of the supporting body, the supportingmember will not be deformed to prevent the deformation of the lead wireso as to maintain the electrical conductivity of the lead wires.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member is extended to enclose at least aportion of the non-photosensitive area of the photosensitive unit toblock the mold material entering into the photosensitive area of thephotosensitive unit from the non-photosensitive area thereof so as toprevent the contamination of the photosensitive area of thephotosensitive unit.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member is configured to enclose theconnection between the chip connector of the photosensitive unit and thecircuit connector of the circuit board, such that during the moldingprocess, the supporting member will block the mold material to enter tothe connection so as to enhance the reliability of the electricalconnection between the photosensitive unit and the circuit board.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member encloses at least a portion of theperipheral portion of the circuit board during the molding process so asto block the impact force of the mold material to the lead wires.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member encloses at least a portion of theperipheral portion of the circuit board and locates away from thephotosensitive area of the photosensitive unit, such that during theformation of the supporting frame, the supporting frame will notcontaminate of the photosensitive area of the photosensitive unit, so asto prevent any dark spot at the photosensitive unit.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member encloses at least a portion of theperipheral portion of the circuit board and at least a portion of thenon-photosensitive area of the photosensitive unit to securely retainthe circuit board and the photosensitive unit. Therefore, when the uppermold body and the lower mold body are coupled with each other to form amold cavity therebetween, the supporting member is able to retain thecircuit board and the photosensitive unit to prevent the displacementthereof.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member encloses at least a portion of theperipheral portion of the circuit board and at least a portion of thenon-photosensitive area of the photosensitive unit, such that during themolding process, the supporting member can block the mold materialentering to the clearance between the photosensitive unit and thecircuit board.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member encloses at least a portion ofeach of the lead wires, such that during the molding process, the leadwires are protected by the supporting member to maintain the electricalconductivity of the lead wires.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member encloses at least a portion ofeach of the lead wires, such that during the operation of the arrayimaging module, the stray light can be prevented from entering theinterior of the array imaging module so as to enhance the imagingquality of the array imaging module.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member has a predetermined adhesiveability to adhere the contaminants, such as welding powders, duringwelding process of the electronic element, so as to prevent thecontamination of the photosensitive area of the photosensitive unit.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the top side of the supporting member is located abovethe top side of the chip connector of the photosensitive unit to preventthe damage of the chip connector of the photosensitive unit during themolding process.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member encloses the chip connector of thephotosensitive unit, such that during the molding process, thesupporting member will block the mold material entering to or enclosingwith the chip connector of the photosensitive unit, so as to protect thechip connector of the photosensitive unit.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporting member is formed at an outer portion ofthe chip connector of the photosensitive unit to prevent the moldmaterial contacting with the chip connector of the photosensitive unitduring molding process. In other words, the supporting member will blockthe mold material entering to or enclosing with the chip connector ofthe photosensitive unit, so as to protect the chip connector of thephotosensitive unit.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the supporter has at least two supporting cavities tocouple with the drivers or the supporting members for ensuring theoptical lenses to be coaxially aligned with the drivers respectively.

Another advantage of the invention is to an array imaging module and itsmolded photosensitive assembly and manufacturing method for electronicdevice, wherein the light filter is retained between the respectivephotosensitive unit and the respective optical lens for filtering outthe stray light from the optical lens so as to ensure the light enteringinto the interior of the array imaging module for enhancing the imagingquality of the array imaging module.

Additional advantages and features of the invention will become apparentfrom the description which follows, and may be realized by means of theinstrumentalities and combinations particular point out in the appendedclaims.

According to the present invention, the foregoing and other objects andadvantages are attained by a molded photosensitive assembly of an arrayimaging module, which comprises:

a mold sealer; and

a photosensitive device which comprises at least a circuit board and atleast two photosensitive units electrically coupled at the circuitboard, wherein the circuit board and the photosensitive units are sealedby the mold sealer to form a one piece integrated device.

In one embodiment, the mold sealer has two optical windows aligned withthe photosensitive units to form two light channels for thephotosensitive units respectively.

In one embodiment, each of the optical windows of the mold sealer isconfigured to have a tapered size that a cross section of the opticalwindow is gradually increased from bottom to top.

In one embodiment, a top side of the mold sealer is arranged forsupporting a supporter, an optical lens, a driver or a light filter.

In one embodiment, the mold sealer further has at least a coupling slotformed at a top side thereof and extended corresponding to the opticalwindow for engaging with the supporter, the optical lens, the driver, orthe light filter.

In one embodiment, the mold sealer has an enclosing portion, a lightfilter mounting portion, and a lens mounting portion, wherein the lightfilter mounting portion and the lens mounting portion integrally andupwardly extended from the enclosing portion to form a step-likeplatform to spacedly support the light filter and the optical lens inposition.

In one embodiment, the light filter mounting portion has two mountingslots located corresponding to the optical window to form a first stepof the step-like platform so as to support the light filter thereat. Thelens mounting portion further has two lens mounting slots locatedcorresponding to the optical window to form a second step of thestep-like platform so as to support the optical lens thereat.

In one embodiment, the lens mounting portion further has two lens innerwalls, wherein each of the lens inner walls is a flat surface to couplewith the optical lens without any threaded structure.

In one embodiment, the photosensitive device comprises at least a leadwire electrically connected the photosensitive unit with the circuitboard, wherein the lead wire is enclosed by the mold sealer to preventthe lead wire from being exposure outside.

In one embodiment, the lead wire can be a gold wire, silver wire, cooperwire or aluminum wire.

In one embodiment, the lead wire has a curved configuration toelectrically connect between the photosensitive unit and the circuitboard.

In one embodiment, each photosensitive unit has a photosensitive areaand a non-photosensitive area, wherein the photosensitive area isencircled within the non-photosensitive area. The mold sealer isextended inwardly from the non-photosensitive area towards thephotosensitive area to minimize the peripheral size of the mold sealer.

In one embodiment, the photosensitive device comprises at least anelectronic element protruded from the circuit board, wherein the moldsealer encloses the electronic element to prevent the electronic elementfrom being exposure outside.

In one embodiment, the electronic element can be a resistor, acapacitor, a diode, a triode, a potentiometer, a relay, a driver, aprocessor, or a combination of above.

In one embodiment, the photosensitive device comprises at least twolight filters covering the photosensitive units respectively, whereinthe mold sealer encloses the circuit board, the photosensitive units,and the light filters, such that each of the photosensitive units isprotected by the respective light filter to reduce the focal length andthe height of the array imaging module.

In one embodiment, the photosensitive device further comprises areinforcing layer overlapped and connected to the circuit board toreinforce the strength of the circuit board.

In one embodiment, the reinforcing layer is a metal panel to enhance theheat dissipation of the circuit board.

In one embodiment, the photosensitive device further comprises ashielding layer that encloses the circuit board and the mold sealer toenhance the strength of the circuit board and to prevent anyelectromagnetic interference of the molded photosensitive assembly.

In one embodiment, the shielding layer can be a metal panel or a metalnet.

In one embodiment, the photosensitive device has a least a reinforcingslot, wherein the mold sealer is extended into the reinforcing slot toenhance the strength of the circuit board.

In one embodiment, the reinforcing slot is an indention cavity.

In one embodiment, the reinforcing slot is a through slot, such that themold sealer is extended through the circuit board to maximize acontacting area therebetween and to integrally form with the circuitboard so as to combine the mold sealer with the circuit board. Inaddition, the reinforcing slot as the through slot can be easily formedon the circuit board.

In one embodiment, the circuit board can be a soft-hard combinationboard, a ceramic substrate, a hard PCB board, or a FPC.

In one embodiment, the mold material of the mold sealer can be nylon,LCP (Liquid Crystal Polymer), PP (Polypropylene), or the combination ofabove.

In one embodiment, the molded photosensitive assembly further comprisesat least two motor connecting units, each of the motor connecting unitshaving a first connecting wire embedded in the mold sealer andelectrically connected to the circuit board. The first connecting wirehas a first motor connecting end exposed and extended above the top sideof the mold sealer to electrically connect to the driver connectingterminal of the driver.

In one embodiment, the molded photosensitive assembly further comprisesat least two motor connecting units, each of the motor connecting unitshaving at least a connecting wire and a terminal slot. The connectingwire is embedded in the mold sealer and electrically connected to thecircuit board. The first terminal slot of the motor connecting unit isextended to the top side of the mold sealer. The connecting wire is setat the mold sealer and is extended to the bottom wall surface of theterminal slot. The connecting wire comprises a second motor connectingend provided at the mold sealer and extended to the bottom wall surfaceof the terminal slot, wherein the second motor connecting end iselectrically coupled to the driver connecting terminal of the driver.

In one embodiment, the molded photosensitive assembly further comprisesat least two motor connecting units, each of the motor connecting unitshaving at least a terminal slot and at least a circuit terminal. Thecircuit terminal is pre-set at the circuit board and electricallyconnected to the circuit board. The terminal slot is provided in themold sealer and is extended from the circuit board to the top side ofthe mold sealer. The circuit terminal is extended corresponding to theterminal slot for connecting with the driver connecting terminal of thedriver.

In one embodiment, the molded photosensitive assembly further comprisesat least two motor connecting units, each of the motor connecting unitshaving at least an engraving circuit electrically connected to thecircuit board, wherein the engraving circuit is embedded in the moldsealer for connecting with the driver connecting terminal of the driver.

In one embodiment, the engraving circuit is formed by Laser DirectStructuring (LDS) to be embedded in the mold sealer.

In accordance with another aspect of the invention, the presentinvention comprises an array imaging module, which comprises:

a molded photosensitive assembly which comprises a mold sealer and aphotosensitive device which comprises at least a circuit board and atleast two photosensitive units electrically coupled at the circuitboard, wherein the circuit board and the photosensitive units are sealedby the mold sealer to form a one piece integrated device; and

at least two optical lenses coupled to the molded photosensitiveassembly and located along two photosensitive paths of thephotosensitive units respectively.

In one embodiment, the array imaging module further comprises asupporter coupled at the photosensitive units, and at least two lightfilters being supported by the supporter.

In one embodiment, the array imaging module further comprises at leasttwo drivers operatively coupled to the two optical lenses respectively,wherein the drivers are coupled to the photosensitive unitsrespectively.

In one embodiment, the array imaging module further comprises at leasttwo light filters coupled to the photosensitive units respectively.

In one embodiment, the array imaging module further comprises at leasttwo light filters integrally formed with the photosensitive unitsrespectively by the mold sealer.

In accordance with another aspect of the invention, the presentinvention comprises a manufacturing method of a molded photosensitiveassembly of an array imaging module, which comprises a step of: moldinga mold sealer to integrally enclose, package and seal a circuit boardand at least two photosensitive units.

In one embodiment, before the molding step, the method further comprisesa step of electrically connecting the photosensitive units to thecircuit board via at least a lead wire.

In one embodiment, the molding step further comprises a step ofenclosing the lead wire by the mold sealer.

In one embodiment, the molding step further comprises a step ofextending the mold sealer to a non-photosensitive area of thephotosensitive unit.

In one embodiment, the method further comprises a step of forming atleast a coupling slot at a top side of the mold sealer for engaging withthe supporter, the optical lenses, the drivers or the light filters.

In one embodiment, the method further comprises a step of forming astep-like platform that upwardly extends from an inner side of the moldsealer for spacedly supporting the light filters and the optical lensesin position.

In one embodiment, the molding step further comprises a step of forminga threaded structure at an inner wall of the mold sealer for couplingwith the optical lenses with a corresponding threaded configuration.

In one embodiment, before the molding step, the method further comprisesa step of forming at least a reinforcing slot, which is an indentioncavity, at the circuit board, wherein the mold sealer is extended intothe reinforcing slot to enhance the strength of the circuit board.

In one embodiment, before the molding step, the method further comprisesa step of forming at least a reinforcing slot, which is a through slot,at the circuit board, wherein the mold sealer is extended into thereinforcing slot to enhance the strength of the circuit board.

In one embodiment, before the molding step, the method further comprisesa step of forming at least a reinforcing layer overlapped and connectedto the circuit board to reinforce the strength of the circuit board.

In one embodiment, the molding step further comprises a step of forminga shielding layer that encloses the circuit board and the mold sealer toenhance the strength of the circuit board and to prevent anyelectromagnetic interference of the molded photosensitive assembly.

In one embodiment, the molding step further comprises a step ofpre-setting a plurality of connecting wires in the mold sealer that areelectrically connected to the circuit board for electrically connectingwith the drivers respectively.

In one embodiment, the molding step further comprises a step ofpre-setting a plurality of terminal slots at the top side of the moldsealer for enabling the driver connecting terminals of the connectingwires exposing at the terminal slots respectively.

In one embodiment, the molding step further comprises a step ofpre-setting a plurality of terminal slots in the mold sealer and aplurality of circuit terminals at the circuit board and extended toexpose at the terminal slots respectively for the driver connectingterminals of the drivers inserted into the terminal slots to connectwith the circuit terminals respectively.

In one embodiment, the molding step further comprises a step ofpre-setting a plurality of engraving circuits electrically connected tothe circuit board, wherein the engraving circuits are embedded in themold sealer for electrically connecting with the drivers respectively.

In one embodiment, the engraving circuit is formed by Laser DirectStructuring (LDS) to be embedded in the mold sealer.

In accordance with another aspect of the invention, the presentinvention comprises a molded photosensitive assembly, which comprises:

a supporting member formed by a first medium;

at least a circuit board which has a chip coupling area;

at least two photosensitive units coupled at the chip coupling area ofsaid circuit board;

at least two lead wires each having two ends, wherein the ends of thelead wires are electrically connected to the chip connectors of thephotosensitive units and the chip coupling areas of said circuit boardrespectively; and

a mold sealer which is made of a second medium, wherein the mold sealercomprises a main mold body and has at least two optical windows, whereinwhen the main mold body of the mold sealer is formed, the lead wires,the circuit board, and the photosensitive units are sealed and molded bythe main mold body of the mold sealer, such that after the main moldbody is formed, the main mold body and at least a portion of the circuitboard are integrally formed together at a position that thephotosensitive units are aligned with the optical windows respectively.

In one embodiment, the molded photosensitive assembly is constructed tohave two supporting members, one circuit board, two photosensitive unitsand two sets of lead wires, wherein the circuit board has two chipcoupling areas.

In one embodiment, the molded photosensitive assembly is constructed tohave two supporting members, two circuit boards, two photosensitiveunits and two sets of lead wires, wherein each of the circuit boards hasone chip coupling area.

In one embodiment, the molded photosensitive assembly further comprisesat least an electronic element, wherein the circuit board further has aperipheral area integrally extended from the chip coupling area, whereinthe electronic element is electrically coupled at the peripheral area ofthe circuit board, wherein the supporter is located between theelectronic element and a photosensitive area of the photosensitive unit.

In one embodiment, the supporting member comprises an encircling frameshaped supporting body and has a through hole, wherein the supportingbody is coupled at the photosensitive unit out of the photosensitivearea thereof, wherein the photosensitive area of the photosensitive unitis aligned with the through hole, wherein at least a portion of thesupporting member is enclosed by the mold sealer.

In one embodiment, the supporting member has a top side, an innerlateral side, and an outer lateral side, wherein the inner lateral sideand the outer lateral side are inwardly and outwardly extended from thetop side respectively, wherein the through hole is formed within theinner lateral side, wherein at least the outer lateral side of thesupporting member is enclosed by the mold sealer.

In one embodiment, the supporting member has a top side, an innerlateral side, and an outer lateral side, wherein the inner lateral sideand the outer lateral side are inwardly and outwardly extended from thetop side respectively, wherein the through hole is formed within theinner lateral side, wherein at least the outer lateral side and the topside of the supporting member are enclosed by the mold sealer.

In one embodiment, the non-photosensitive area of the photosensitiveunit has a chip inner lateral side, a chip connecting portion, and achip outer lateral side, wherein the chip connector is formed at thechip connecting portion, wherein the chip connecting portion is locatedbetween the chip inner lateral side and the chip outer lateral side,wherein at least a portion of the chip inner lateral side of thephotosensitive unit are enclosed by the supporting body.

In one embodiment, the non-photosensitive area of the photosensitiveunit has a chip inner lateral side, a chip connecting portion, and achip outer lateral side, wherein the chip connector is formed at thechip connecting portion, wherein the chip connecting portion is locatedbetween the chip inner lateral side and the chip outer lateral side,wherein at least a portion of the chip connecting portion of thephotosensitive unit are enclosed by the supporting body.

In one embodiment, the non-photosensitive area of the photosensitiveunit has a chip inner lateral side, a chip connecting portion, and achip outer lateral side, wherein the chip connector is formed at thechip connecting portion, wherein the chip connecting portion is locatedbetween the chip inner lateral side and the chip outer lateral side,wherein at least a portion of the chip outer lateral side of thephotosensitive unit are enclosed by the supporting body.

In one embodiment, the non-photosensitive area of the photosensitiveunit has a chip inner lateral side, a chip connecting portion, and achip outer lateral side, wherein the chip connector is formed at thechip connecting portion, wherein the chip connecting portion is locatedbetween the chip inner lateral side and the chip outer lateral side,wherein at least a portion of each of the chip inner lateral side andthe chip connecting portion of the photosensitive unit are enclosed bythe supporting body.

In one embodiment, the non-photosensitive area of the photosensitiveunit has a chip inner lateral side, a chip connecting portion, and achip outer lateral side, wherein the chip connector is formed at thechip connecting portion, wherein the chip connecting portion is locatedbetween the chip inner lateral side and the chip outer lateral side,wherein at least a portion of each of the chip outer lateral side andthe chip connecting portion of the photosensitive unit are enclosed bythe supporting body.

In one embodiment, the non-photosensitive area of the photosensitiveunit has a chip inner lateral side, a chip connecting portion, and achip outer lateral side, wherein the chip connector is formed at thechip connecting portion, wherein the chip connecting portion is locatedbetween the chip inner lateral side and the chip outer lateral side,wherein at least a portion of the chip inner lateral side, the chipconnecting portion, and at least a portion of chip outer lateral side ofthe photosensitive unit are enclosed by the supporting body.

In one embodiment, the non-photosensitive area of the photosensitiveunit has a chip inner lateral side, a chip connecting portion, and achip outer lateral side, wherein the chip connector is formed at thechip connecting portion, wherein the chip connecting portion is locatedbetween the chip inner lateral side and the chip outer lateral side,wherein at least a portion of the chip inner lateral side and at least aportion of chip outer lateral side of the photosensitive unit areenclosed by the supporting body.

In one embodiment, the non-photosensitive area of the photosensitiveunit has a chip inner lateral side, a chip connecting portion, and achip outer lateral side, wherein the chip connector is formed at thechip connecting portion, wherein the chip connecting portion is locatedbetween the chip inner lateral side and the chip outer lateral side,wherein the chip inner lateral side, at least a portion of the chipconnecting portion, and at least a portion of chip outer lateral side ofthe photosensitive unit are enclosed by the supporting body.

In one embodiment, the non-photosensitive area of the photosensitiveunit has a chip inner lateral side, a chip connecting portion, and achip outer lateral side, wherein the chip connector is formed at thechip connecting portion, wherein the chip connecting portion is locatedbetween the chip inner lateral side and the chip outer lateral side,wherein the chip inner lateral side, the chip connecting portion, atleast a portion of chip outer lateral side of the photosensitive unit,and at least a portion of the outer peripheral portion of thephotosensitive unit are enclosed by the supporting body.

In one embodiment, at least a portion of the chip connecting portion ofthe photosensitive unit is enclosed by the supporting body.

In one embodiment, at least a portion of the chip inner lateral side ofthe photosensitive unit is enclosed by the supporting body.

In one embodiment, at least a portion of the chip outer lateral side ofthe photosensitive unit is enclosed by the supporting body.

In accordance with another aspect of the invention, the presentinvention comprises an array imaging module, comprising:

at least two optical lenses; and

a molded photosensitive assembly, which comprises:

a supporting member formed by a first medium;

at least a circuit board each having at least a chip coupling area;

at least two photosensitive units each of which is coupled at the chipcoupling area of the circuit board;

at least two lead wires electrically coupling between chip connectors ofthe photosensitive units and the chip coupling areas of said circuitboard respectively; and

a mold sealer which is made of a second medium, wherein the mold sealercomprises a main mold body and has at least two optical windows, whereinwhen the main mold body of the mold sealer is formed, the lead wires,the circuit board and the photosensitive units are sealed and molded bythe main mold body of the mold sealer, such that after the main moldbody is formed, the main mold body and at least a portion of the circuitboard are integrally formed together at a position that thephotosensitive units are aligned with the optical windows respectively,wherein the optical lenses are installed aligned the photosensitivepaths of the photosensitive units so as to provide at least of lightchannels via the optical windows for the optical lenses and thephotosensitive units respectively.

In one embodiment, the array imaging module further comprises at leasttwo drivers, wherein the optical lenses are operatively coupled with thedrivers respectively, wherein the drivers are installed at a top side ofthe main mold body of the mold sealer.

In one embodiment, the array imaging module further comprises at least adriver and at least a lens barrel, wherein each of the optical lenses isoperatively coupled at the respective driver and lens barrel, whereinthe driver and the lens barrel are coupled at the top side of the mainmold body of the mold sealer at different locations.

In one embodiment, the lens barrel is integrally extended from the topside of the main mold body of the mold sealer.

In one embodiment, the lens barrel is mounted at the top side of themain mold body of the mold sealer.

In one embodiment, the array imaging module further comprises at leasttwo lens barrels which are integrally extended from the top side of themain mold body of the mold sealer, wherein the optical lenses areoperatively coupled to the lens barrels respectively.

In one embodiment, the array imaging module further comprises at leasttwo lens barrels, wherein one of the lens barrels is integrally extendedfrom the top side of the main mold body of the mold sealer and anotherlens barrel is mounted at top side of the main mold body of the moldsealer, wherein the optical lenses are operatively coupled to the lensbarrels respectively.

In one embodiment, the array imaging module further comprises at leasttwo lens barrels which are coupled at a top side of the main mold bodyof the mold sealer, wherein the optical lenses are operatively coupledto the lens barrels respectively.

In one embodiment, the array imaging module further comprises asupporter having at least two supporting cavities, wherein the driversare received at the supporting cavities respectively.

In one embodiment, the array imaging module further comprises asupporter having at least two supporting cavities, wherein the driverand the lens barrel are received at the supporting cavitiesrespectively.

In one embodiment, the array imaging module further comprises asupporter having at least two supporting cavities, wherein the lensbarrels are received at the supporting cavities respectively.

In one embodiment, a filler is filled between an outer casing of thedriver and an inner wall of the supporter.

In one embodiment, a filler is filled between an outer casing of thedriver and an inner wall of the supporter, and between the lens barreland the inner wall of the supporter.

In one embodiment, a filler is filled between the lens barrel and aninner wall of the supporter.

In one embodiment, the filler is adhesive.

In one embodiment, the array imaging module further comprises at least alight filter coupled at the top side of the main mold body of the moldsealer, wherein the light filter is supported between the optical lensand the photosensitive unit.

In one embodiment, the main mold body has at least two inner lateral topsurfaces and an outer lateral top surface, wherein the light filter iscoupled at the inner lateral top surface of the main mold body, and thedriver is coupled at the outer lateral top surface of the main moldbody.

In one embodiment, the inner lateral top surface of the main mold bodyis located below the outer lateral top surface to form at least anindention slot, wherein the light filter is coupled at the inner lateraltop surface within the indention slot.

In one embodiment, the array imaging module further comprises asupporting member and at least a light filter, wherein the light filteris coupled at the supporting member, wherein the supporting member iscoupled at a top side of the main mold body, so as to retain the lightfilter at a position between the optical lens and the photosensitiveunit.

In one embodiment, the main mold body has at least two inner lateral topsurfaces and an outer lateral top surface, wherein the supporting memberis coupled at the inner lateral top surface of the main mold body, andthe driver is coupled at the outer lateral top surface of the main moldbody.

In one embodiment, the inner lateral top surface of the main mold bodyis located below the outer lateral top surface to form at least anindention slot, wherein the supporting member is coupled at the innerlateral top surface within the indention slot.

In one embodiment, the supporting member has an encircling frame shapesupporting body and a through hole, wherein the supporting body iscoupled at the photosensitive unit out of the photosensitive areathereof, wherein the photosensitive area of the photosensitive unit isaligned with the through hole, wherein at least a portion of thesupporting member is enclosed by the mold sealer.

In one embodiment, at least a portion of the peripheral portion of thecircuit board is enclosed by the supporting member.

In one embodiment, at least a portion of the non-photosensitive area ofthe photosensitive unit is enclosed by the supporting member.

In one embodiment, at least a portion of the peripheral portion of thecircuit board and at least a portion of the non-photosensitive area ofthe photosensitive unit are enclosed by the supporting member.

In one embodiment, the supporting member has a predetermined elasticity.

In one embodiment, the supporting member has a predetermined adhesiveability.

In one embodiment, the supporting member is made of adhesive aftersolidification.

In one embodiment, the Shore A hardness of the supporting body has arange between A50 and A80.

In one embodiment, the elasticity of the supporting body has a rangebetween 0.1 Gpa and 1 Gpa.

In one embodiment, the thickness of the supporting member is larger thanor equal to an apex of the lead wire being bent in a curveconfiguration.

In one embodiment, at least two drivers are integrally formed at a motorcarrier.

In accordance with another aspect of the invention, the presentinvention comprises an electronic device, comprising:

an electronic device body; and

at least an array imaging module mounted in the device body for imagecapturing, wherein the array imaging module comprises:

at least two optical lenses; and

a molded photosensitive assembly which comprises:

a supporting member formed by a first medium;

at least a circuit board which has a chip coupling area;

at least two photosensitive units coupled at the chip coupling area ofsaid circuit board;

at least two lead wires electrically coupling between chip connectors ofthe photosensitive units and the chip coupling areas of said circuitboard respectively;

a mold sealer which is made of a second medium, wherein the mold sealerhas a main mold body and at least two optical windows, wherein when themain mold body of the mold sealer is formed, the lead wires, the circuitboard and the photosensitive units are molded and protected by the mainmold body of the mold sealer, such that after the main mold body isformed, the main mold body and at least a portion of the circuit boardare integrally formed together to form an integral body positioned at aposition that the photosensitive units are aligned with the opticalwindows respectively, wherein the optical lenses are installed to alignwith the photosensitive paths of the photosensitive units respectively,so as to provide a light channel for each of optical lenses and therespective photosensitive unit via the respective optical window.

Still further objects and advantages will become apparent from aconsideration of the ensuing description and drawings.

These and other objectives, features, and advantages of the presentinvention will become apparent from the following detailed description,the accompanying drawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B illustrate a conventional dual lens camera module.

FIG. 2 is a perspective view of an array imaging module according to afirst preferred embodiment of the present invention.

FIG. 3 is a sectional view of the array imaging module according to thefirst preferred embodiment of the present invention.

FIG. 4 is a perspective view illustrating the manufacturing process ofthe array imaging module according to the first preferred embodiment ofthe present invention.

FIG. 5 is a block diagram illustrating the manufacturing process of thearray imaging module according to the first preferred embodiment of thepresent invention.

FIGS. 6A and 6B illustrates different structural configurations of thearray imaging module according to the first preferred embodiment of thepresent invention.

FIGS. 7A, 7B, and 7C illustrates different structural configurations ofthe motor connecting unit of the array imaging module the according tothe first preferred embodiment of the present invention.

FIG. 8 illustrates a first alternative mode of the array imaging moduleaccording to the first preferred embodiment of the present invention.

FIG. 9 is a sectional view of the array imaging module according to asecond preferred embodiment of the present invention.

FIGS. 10A to 10C illustrates three different manufacturing processes forthe array imaging module according to a third preferred embodiment ofthe present invention.

FIG. 11 is a sectional view of the array imaging module according to afourth preferred embodiment of the present invention.

FIG. 12 is a sectional view of the array imaging module according to afifth preferred embodiment of the present invention.

FIG. 13 is a sectional view of the array imaging module according to asixth preferred embodiment of the present invention.

FIG. 14 is a sectional view of the array imaging module according to aseventh preferred embodiment of the present invention.

FIG. 15 is a sectional view of the array imaging module according to aneighth preferred embodiment of the present invention.

FIG. 16 illustrates the manufacturing process of the array imagingmodule according to the above embodiments of the present invention.

FIG. 17 is a sectional view of the array imaging module according to aninth preferred embodiment of the present invention.

FIG. 18 illustrates the manufacturing process of the array imagingmodule according to the above preferred embodiments of the presentinvention, wherein the step 1 of coupling the photosensitive unit at thechip coupling area of the circuit board and electrically connecting thechip connector of the photosensitive unit at the connecting circuit ofthe circuit board via a lead wire, wherein the circuit board is anintegrated one piece circuit board.

FIG. 19 illustrates the manufacturing process of the array imagingmodule according to the above preferred embodiments of the presentinvention, wherein the step 2 of forming the supporter to enclose atleast a portion of the non-photosensitive area of the photosensitiveunit to form a semi-product of the array imaging module.

FIG. 20A illustrates the manufacturing process of the array imagingmodule according to the above preferred embodiments of the presentinvention, wherein the step 3 of disposing the semi-product between theupper mold body and the lower mold body of the mold at a position thatthe mold engaging surface of the upper mold body is pressed on the topside of the supporting body.

FIG. 20B illustrates an alternative mode of the manufacturing process ofthe array imaging module according to the above preferred embodiments ofthe present invention, wherein the step 3 of providing the enclosingfilm at the mold engaging surface of the upper mold body, wherein theenclosing film is sandwiched between the mold engaging surface of theupper mold body and the top side of the supporting body.

FIG. 21 illustrates the manufacturing process of the array imagingmodule according to the above preferred embodiments of the presentinvention, wherein the step 4 of introducing the mold material into themold cavity between the upper mold body and the lower mold body of themold.

FIG. 22 illustrates the manufacturing process of the array imagingmodule according to the above preferred embodiments of the presentinvention, wherein the step 5 of solidifying the mold material to formthe mold sealer, so as to form the molded photosensitive assembly.

FIG. 23 illustrates the manufacturing process of the array imagingmodule according to the above preferred embodiments of the presentinvention, wherein the step 6 of coupling the light filter at the topside of the mold sealer.

FIG. 24 illustrates the manufacturing process of the array imagingmodule according to the above preferred embodiments of the presentinvention, wherein the step 7 of coupling the driver to the opticallens, wherein the driver is coupled at the top side of the mold sealer.

FIG. 25 illustrates an alternative mode of the array imaging moduleaccording to the above preferred embodiments of the present invention,wherein the drivers are coupled at the supporting cavities of thesupporter respectively.

FIG. 26 is a perspective view of the array imaging module according tothe above preferred embodiments of the present invention.

FIG. 27 illustrates a first alternative mode of the array imaging moduleaccording to the above preferred embodiments of the present invention.

FIG. 28 illustrates a second alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 29 illustrates a third alternative mode of the array imaging moduleaccording to the above preferred embodiments of the present invention.

FIG. 30 illustrates a fourth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 31 illustrates a fifth alternative mode of the array imaging moduleaccording to the above preferred embodiments of the present invention.

FIG. 32 illustrates a sixth alternative mode of the array imaging moduleaccording to the above preferred embodiments of the present invention.

FIG. 33 illustrates a seventh alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 34 illustrates an eighth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 35A illustrates a ninth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 35B illustrates a tenth alternative mode of the array imagingmodule according to the above preferred embodiments of the presentinvention.

FIG. 36A illustrates a first alternative mode of the semi-product of thearray imaging module according to the above preferred embodiments of thepresent invention, illustrating the supporting body enclosing at least aportion of the peripheral portion of the circuit board, and at least aportion of the circuit board outer lateral side, the circuit boardconnecting portion, and the circuit board inner lateral side of thephotosensitive unit.

FIG. 36B illustrates a second alternative mode of the semi-product ofthe array imaging module according to the above preferred embodiments ofthe present invention, illustrating the supporting body enclosing atleast a portion of the peripheral portion of the circuit board, and atleast a portion of the circuit board outer lateral side and the circuitboard connecting portion of the photosensitive unit.

FIG. 36C illustrates a third alternative mode of the semi-product of thearray imaging module according to the above preferred embodiments of thepresent invention, illustrating the supporting body enclosing at least aportion of the peripheral portion of the circuit board, and at least aportion of the circuit board outer lateral side of the photosensitiveunit.

FIG. 36D illustrates a fourth alternative mode of the semi-product ofthe array imaging module according to the above preferred embodiments ofthe present invention, illustrating the supporting body enclosing atleast a portion of the peripheral portion of the circuit board.

FIG. 36E illustrates a fifth alternative mode of the semi-product of thearray imaging module according to the above preferred embodiments of thepresent invention, illustrating the supporting body enclosing at least aportion of the peripheral portion of the circuit board.

FIG. 37 illustrates an alternative mode of the array imaging moduleaccording to the above preferred embodiments of the present invention,illustrating the mold sealer enclosing the outer lateral side of thesupporter.

FIG. 38 illustrates a first alternative mode of the structuralconfiguration of the array imaging module according to the abovepreferred embodiments of the present invention.

FIG. 39 illustrates a second alternative mode of the structuralconfiguration of the array imaging module according to the abovepreferred embodiments of the present invention.

FIG. 40 illustrates a third alternative mode of the structuralconfiguration of the array imaging module according to the abovepreferred embodiments of the present invention.

FIG. 41 illustrates a fourth alternative mode of the structuralconfiguration of the array imaging module according to the abovepreferred embodiments of the present invention.

FIG. 42 illustrates a fifth alternative mode of the structuralconfiguration of the array imaging module according to the abovepreferred embodiments of the present invention.

FIG. 43 illustrates an electronic device built-in with the array imagingmodule according to the above preferred embodiments of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description is disclosed to enable any person skilled inthe art to make and use the present invention. Preferred embodiments areprovided in the following description only as examples and modificationswill be apparent to those skilled in the art. The general principlesdefined in the following description would be applied to otherembodiments, alternatives, modifications, equivalents, and applicationswithout departing from the spirit and scope of the present invention.

It is appreciated that the terms “longitudinal”, “transverse”, “upper”,“lower”, “front”, “rear”, “left”, “right”, vertical”, “horizontal”,“top”, “bottom”, “exterior”, and “interior” in the following descriptionrefer to the orientation or positioning relationship in the accompanyingdrawings for easy understanding of the present invention withoutlimiting the actual location or orientation of the present invention.Therefore, the above terms should not be an actual location limitationof the elements of the present invention.

Referring to FIGS. 2 to 6A, an array imaging module according to a firstembodiment of the present invention is illustrated, wherein the arrayimaging module comprises a molded photosensitive assembly 20 used toassemble and produce the array imaging module. The molded photosensitiveassembly 20 comprises a mold sealer 27 (also named as molded base inother embodiments) and a photosensitive device 28 which is integrallysealed by and coupled to the mold sealer 27. For example, the moldsealer 27 is molded and formed at the photosensitive device 28.

The photosensitive device 28 comprises at least a circuit board 22 andat least two photosensitive units 21 which are electrically coupled atthe circuit board 22. In one embodiment, the photosensitive units 21 aremolded and connected to the circuit board 22. In particular, the moldsealer 27 is molded and formed at the photosensitive device 28 byMolding on Chip (MOC) method.

The mold sealer 27 has two optical windows 231, wherein the mold sealer27 is formed at an outer periphery of the photosensitive unit 21. Twooptical lenses 10 are located along optical paths of the photosensitiveunits 21 respectively. In particular, the optical lenses 10 aresupported at the optical windows 231 of the mold sealer 27 correspondingto the locations of the circuit board 22.

The mold sealer 27 comprises a connecting body 271 and two outer annularbodies 272, wherein the connecting body 271 is integrally extendedbetween the outer annular bodies 272, such that the optical windows 231are defined at the outer annular bodies 272 respectively. Accordingly,the photosensitive units 21 are positioned at two sides of theconnecting body 271 respectively. It is worth mentioning that theconnecting body 271 serves as a common sharing portion for the opticallenses 10, such that when the optical lenses 10 are coupled at theconnecting body 271, same portions of the optical lenses 10 will occupythe connecting body 271.

According to the preferred embodiment, the photosensitive device 28comprises a connecting circuit (not shown in drawings) and at least anelectronic element 26. The connecting circuit is pre-formed on thecircuit board 22. The electronic element 26 is electrically connected tothe connecting circuit to couple at the circuit board 22, wherein theelectronic element 26 is electrically connected to the photosensitiveunits 21 for operating the photosensitive process of the photosensitiveunits 21. The electronic element 26 is outwardly protruded from thecircuit board 22. The electronic element 26 can be, but not limit to, aresistor, a capacitor, a diode, a triode, a potentiometer, a relay, aprocessor, a driver, or etc.

It is worth mentioning that the electronic element 26 is enclosed by themold sealer 27 to prevent the exposure of the electronic element 26 fromair outside. In other words, the electronic element 26 is hidden withinthe mold sealer 27 to prevent any contamination, such as dust, from thesurroundings during the operation of the array imaging module. Unlikethe conventional camera module, the electronic element 26, such as thecapacitor, is exposed to the surroundings. Therefore, the mold sealer 27of the present invention can prevent any dust or residue remaining atthe surface of the electronic element 26 to contaminate thephotosensitive unit 21 which may cause a black spot and the like on theimage.

It is worth mentioning that the electronic element 26 is protruded fromthe circuit board 22 in one embodiment. In another embodiment, theelectronic element 26 is embedded in the circuit board 22, such that theelectronic element 26 is not protruded from the circuit board 22. It isappreciated that the structure, type, and location of the electronicelement 26 should not be restricted. Accordingly, the electronic element26 can be enclosed by the connecting body 271 at a position between thetwo photosensitive units 21. Therefore, unlike the conventional cameramodule, the array imaging module of the present invention does notrequire any additional installing space for the electronic element 26 soas to reduce the overall size of the array imaging module.

According to the preferred embodiment, the photosensitive device 28further comprises a plurality of connecting elements such as lead wires24 for electrically connecting to the photosensitive units 21 and thecircuit board 22. In particular, the lead wire 24 can be, but not limitto, gold wire, aluminum wire, copper wire, or silver wire. In addition,the lead wire 24 has a curved configuration to electrically connectbetween the photosensitive units 21 and the circuit board 22.

It is worth mentioning that each of the lead wires 24 is sealed andembedded in the mold sealer 27, wherein the lead wires 24 are enclosedby the mold sealer 27, so as to prevent the exposure of the lead wires24 to outside. When assembling the array imaging module, the lead wires24 will not be damaged by any external contact or any external factor,such as temperature. Therefore, the lead wires 24 can effectively andstably transmit signal between the photosensitive units 21 and thecircuit board 22. The embedded lead wires 24 of the present inventionare superior than the exposed wires of the conventional camera module.

In one embodiment, the optical window 231 of the mold sealer 27 can beconfigured to have a tapered size that a cross section of the opticalwindow 231 is gradually increased from bottom to top.

It is worth mentioning that the electronic element 26 and the lead wires24 are enclosed by the mold sealer 27, such that the electronic element26 and the lead wires 24 are protected by the mold sealer 27. It isappreciated that the mold sealer 27 can be directly molded and formed atthe circuit board 22 while the one or more electronic elements 26 areembedded in the circuit board 22. In addition, the mold sealer 27 canalso formed at different locations of the electronic elements 26, suchas at an outer periphery of the electronic elements 26 or surroundingthe electronic elements 26.

Furthermore, each of the photosensitive unit 21 has a photosensitivearea 212 and a non-photosensitive area 213, wherein the photosensitivearea 212 is encircled within the non-photosensitive area 212 and isarranged for providing photosensitive effect. The lead wires 24 areoperatively linked to the non-photosensitive area 213.

According to the preferred embodiment, the mold sealer 27 is extended tothe non-photosensitive area 213 of the photosensitive unit 21 and isoverlappedly coupled at the circuit board 22 via the molding process.Through the molding process, such as Molding on Chip (MOC) method, themold sealer 27 can be enlarged its covering area at its inwarddirection, so as to reduce the outward extension of the mold sealer 27.As a result, the size of the mold sealer 27 can be reduced to minimizethe length and width size of the array imaging module.

According to the preferred embodiment, the mold sealer 27 is protrudedlyencircled around an outer periphery of the photosensitive area 212 ofthe photosensitive unit 21. In particular, the mold sealer 27 isintegrally connected to the photosensitive unit 21 to provide a goodsealing effect therefor. In other words, when the molded photosensitiveassembly 20 is assembled, the photosensitive device is sealed andenclosed therewithin to form a closed environment.

Referring to FIGS. 4 and 5, during the manufacturing process of themolded photosensitive assembly 20, the circuit board 22, which can be aconventional circuit board, can be used for supporting the twophotosensitive units 21, such as coupling the two photosensitive units21 on the circuit board 22. Then, the two photosensitive units 21 can beelectrically connected to the circuit board 22 via the lead wires 24,such as gold wire connection. Then, the photosensitive units 21 and thecircuit board 22 can be initially packed and sealed by molding processto form an integral body. For example, by using a mold injection machinefor introducing or injecting mold material via Insert Molding technologyand Surface Mount Technology to mold and form the mold sealer 27 or viaa semiconductor packaging technology and press mold technology to moldand form the mold sealer 27. The circuit board 22 can be, but notlimited to, a soft-hard combination board, ceramic substrate(non-flexible board), or a hard PCB board (non-flexible board). Themolding process can be, but not limit to, the injection molding processor press-molding process. The injection mold material can be nylon, LCP(Liquid Crystal Polymer), PP (Polypropylene), or the like. It isappreciated that different materials can be selectively used indifferent molding processes and should not be restricted in the presentinvention. The process of forming the mold sealer 27 should not berestricted in the present invention.

Furthermore, the mold sealer 27 has an enclosing portion 273 and a lightfilter mounting portion 274 integrally extended from the enclosingportion 273. The enclosing portion 273 is molded and coupled at thecircuit board 22 to enclose the one or more electronic elements 26 andthe lead wires 24. The light filter mounting portion 274 is arranged forcoupling with a light filter 40. In other words, when assembling themolded photosensitive assembly 20 of the array imaging module, the lightfilter 40 can be coupled at the light filter mounting portion 274 toensure the light filter 40 to be aligned along the photosensitive pathof the respective photosensitive unit 21 without any additional lightfilter supporting frame. Therefore, the mold sealer 27 also serves as asupporter to support the light filter 40. Due to the molding process,the size and shape of the mold sealer 27 can be modified to have aflatness, such that the light filter 40 can be stably coupled at thelight filter mounting portion 274, wherein this feature cannot beachieved by the conventional camera module.

In addition, the light filter mounting portion 274 has two couplingslots 2741 formed corresponding to the optical windows 231 for engagingwith the photosensitive units 21 respectively. Therefore, the lightfilter mounting portion 274 provides enough space for the light filter40 to prevent the light filter 40 being protruded from a top side of thelight filter mounting portion 274. In other words, the two couplingslots 2741 are formed at the light filter mounting portion 274 that thelight filters 40 are engaged with the coupling slots 2741 withoutprotruding out of the top side of the light filter mounting portion 274.Accordingly, the light filter 40 can be an infrared cut-off lightfilter, IRCF.

It is worth mentioning that the coupling slots 2741 can be engaged withthe light filters 40 respectively in one embodiment. In anotherembodiment, the coupling slots 2741 can be used for engaging with motorsor lens barrels of the array imaging module respectively. It isappreciated that the size and shape of the coupling slot 2741 should notbe restricted in the present invention.

It is worth mentioning that the inner wall of the mold sealer 27 can beconfigured corresponding to the shape of the lead wire 24. For example,the inner wall of the mold sealer 27 can be configured in a slantedmanner to not only enclose the lead wire 24 but also reduce anyreflected stray light from the inner wall of the mold sealer 27 so as toenhance the imaging quality of the array imaging module. It isappreciated that the shape of the mold sealer 27 should not berestricted in the present invention.

Furthermore, according to the preferred embodiment, the moldedphotosensitive assembly 20 comprises at least two motor connecting units29, wherein each of the motor connecting units 29 is arranged to connectto a driver 30. The driver 30 comprises at least a driver connectingterminal 31. Each of the motor connecting units 29 comprises a firstconnecting wire 291 that electrically connects to the driver 30 and thecircuit board 22. In particular, the first connecting wire 291 iselectrically connected to the circuit board 22. In other words, thefirst connecting wire 291 is electrically connected to the connectingcircuit of the circuit board 22. Accordingly, the first connecting wire291 is enclosed in the mold sealer 27 and extended to the top side ofthe mold sealer 27. The first connecting wire 291 has a motor connectingend 2911 extended above and exposed from the top side of the mold sealer27 to electrically connect to the driver connecting terminal 31 of thedriver 30. It is worth mentioning that the first connecting wire 291 canbe embedded in the mold sealer 27 during the mold sealer 27 is formed.In view of the conventional camera module, the driver must beelectrically connected to the circuit board via a separated wire bywelding two ends of the wire at the driver and the circuit board, suchthat the manufacturing process of the conventional camera module iscomplicated. In the preferred embodiment, the first connecting wire 291is pre-formed in the mold sealer 27 to replace the conventional weldingprocess of the separated wire. Therefore, the driver connecting terminal31 can be electrically connected to the motor connecting end 2911 of thefirst connecting wire 291 via an anisotropic conductive film or welding.

It is worth mentioning that the embedded location of the firstconnecting wire 291 and the exposing location of the motor connectingend 2911 can be modified according to the requirement of the driver 30.For example, the motor connecting end 2911 of the first connecting wire291 is located at an outer peripheral portion of the mold sealer 27,i.e. the top side of the mold sealer 27 in one embodiment. In anotherembodiment, the motor connecting end 2911 of the first connecting wire291 is located at an inner peripheral portion of the mold sealer 27,i.e. the bottom side of the coupling slot 2741. Therefore, differentlocations of the first connecting wire 291 are designed for connectingdifferent drivers 30. In other words, when the driver 30 is required forinstalling at the top side of the mold sealer 27, the motor connectingend 2911 of the first connecting wire 291 is extended to the outerperipheral portion of the mold sealer 27 at the top side thereof. Whenthe driver 30 is required for installing at the coupling slot 2741, themotor connecting end 2911 of the first connecting wire 291 is extendedto the inner peripheral portion of the mold sealer 27 at the bottom sideof the coupling slot 2741.

In other words, during the manufacturing process of the moldedphotosensitive assembly 20, the photosensitive unit 21 is initiallymounted on and electrically connected to the circuit board 22, and thenthe mold sealer 27 is molded on the circuit board 22 via the MOC(Molding on Chip) method. During the molding process, the firstconnecting wire 291 is pre-formed and embedded in the mold sealer 27 toensure the first connecting wire 291 to be electrically connected to thecircuit board 22. At the same time, the motor connecting end 2911 of thefirst connecting wire 291 is exposed out of the top side of the moldsealer 27 for electrically connecting to the driver connecting terminal31 of the driver 30. For example, when the molded photosensitiveassembly 20 is in use for the array imaging module, the driverconnecting terminal 31 of the driver 30 can be connected to the motorconnecting end 2911 of the first connecting wire 291 by welding.Therefore, the driver 30 is electrically connected to the circuit board22 without any additional separated wire, so as to reduce the length ofthe driver connecting terminal 31 of the driver 30.

Referring to FIGS. 2 to 6A, the array imaging module can be an AutomaticFocus Camera Module (AFCM). The array imaging module is constructed tohave the molded photosensitive assembly 20, two light filters 40, twodrivers 30, and two optical lenses 10.

The light filters 40 are installed at the molded photosensitive assembly20, wherein the optical lenses 10 are installed to the drivers 30respectively, and the drivers 30 are installed at the moldedphotosensitive assembly 20.

In addition, the light filters 40 are coupled at the coupling slots 2741of the light filter mounting portion 274 of the mold sealer 27. Thedrivers 30 are coupled at the top side of the light filter mountingportion 274 of the mold sealer 27 of the molded photosensitive assembly20.

The driver connecting terminals 31 of the drivers 30 are electricallyconnected to the motor connecting ends 2911 of the motor connectingunits 29 respectively, wherein the drivers 20 are electrically connectedto the circuit board 22 via the motor connecting units 29.

It is appreciated that the structural configurations and types of thearray imaging module as mentioned above are examples for illustrativepurpose without intention to limit the present invention.

FIG. 7A illustrates an alternative mode of the motor connecting unit ofthe present invention. Accordingly, the motor connecting unit 29comprises a first terminal slot 292, wherein the driver connectingterminal 31 of the driver 30 is received at the first terminal slot 292.The first terminal slot 292 is extended to the top side of the moldsealer 27. The motor connecting unit 29 further comprises a secondconnecting wire 293 for electrically connecting to the driver 30 and thecircuit board 22. The second connecting wire 293 is embedded in the moldsealer 27 and is upwardly extended to the bottom wall of the firstterminal slot 292. The second connecting wire 293 has a second motorconnecting end 2931 extended to the bottom wall of the first terminalslot 292 for electrically connecting to the driver connecting terminal31 of the driver 30. In particular, the second motor connecting end 2931can be formed as a connecting pad. The second connecting wire 293 can bea conductive wire embedded in the mold sealer 27. Therefore, the driverconnecting terminal 31 of the driver 30 can be easily connected to thefirst terminal slot 292. For example, when the molded photosensitiveassembly 20 is in use for the array imaging module, the driverconnecting terminal 31 of the driver 30 can be inserted into the firstterminal slot 292 and connected to the second motor connecting end 2931of the second connecting wire 293 by welding. Therefore, the driver 30is electrically connected to the circuit board 22 without any additionalseparated wire. The driver 30 can be stably connected to prevent anyexternal force or contact to the driver connecting terminal 31 of thedriver 30. In particular, the second motor connecting end 2931 of thesecond connecting wire 293 can be a welding pad. The second connectingwire 293 can be a conductive wire embedded in the mold sealer 27.

In other words, during the manufacturing process of the moldedphotosensitive assembly 20, the photosensitive unit 21 is initiallyformed and electrically connected to the circuit board 22, wherein themold sealer 27 is then formed on the circuit board 22 via the MOCmethod. During the molding process, the first terminal slot 292 with apredetermined length is pre-formed in the mold sealer 27. At the sametime, the second connecting wire 293 is electrically connected to thecircuit board 22, wherein the second motor connecting end 2931 ispre-set to extend to the bottom wall of the first terminal slot 292.Accordingly, the second connecting wire 293 can be a conductive wireembedded in the mold sealer 27.

FIG. 7B illustrates another alternative mode of the motor connectingunit of the present invention. The motor connecting unit 29 comprises asecond terminal slot 294 for receiving the driver connecting terminal 31of the driver 30. The second terminal slot 294 is embedded in the moldsealer 27. The motor connecting unit 29 further comprises a circuitterminal 295 which is pre-set on the circuit board 22 and iselectrically connected to the connecting circuit of the circuit board22. In addition, the second terminal slot 294 is extended from the topside of the mold sealer 27 to the circuit board 22 toward the circuitterminal 295. Therefore, in one embodiment, when the driver connectingterminal 31 of the driver 30 is inserted into the second terminal slot294, the driver connecting terminal 31 of the driver 30 is electricallyconnected to the circuit terminal 295 by welding.

In other words, during the manufacturing process of the moldedphotosensitive assembly 20, the photosensitive unit 21 is initiallyformed and electrically connected to the circuit board 22 and thecircuit terminal 295 is pre-formed on the circuit board 22, wherein themold sealer 27 is then formed on the circuit board 22 via the MOCmethod. During the molding process, the second terminal slot 293 with apredetermined length is pre-formed in the mold sealer 27 and extendedtoward the circuit terminal 295. Therefore, the driver connectingterminal 31 of the driver 30 can be easily connected. For example, whenthe molded photosensitive assembly 20 is in use for the array imagingmodule, the driver connecting terminal 31 of the driver 30 can beinserted into the second terminal slot 293 and connected to the circuitterminal 295 by welding. Therefore, the driver 30 is electricallyconnected to the circuit board 22 that the driver 30 can be stablyconnected to prevent any external force or contact to the driverconnecting terminal 31 of the driver 30.

FIG. 7C illustrates another alternative mode of the motor connectingunit of the present invention. The motor connecting unit 29 comprises anengraving circuit 296 electrically connected to the connecting circuitof the circuit board 22, the photosensitive unit 21, and the motor. Forexample, the engraving circuit 296 can be formed by Laser DirectStructuring (LDS) method to embed at the mold sealer 27 at apredetermined position. According to the conventional connecting method,the motor is electrically connected to the circuit board via anindividual wire, such that the manufacturing process thereof isrelatively complicated. In view of the present invention, the engravingcircuit 296 can replace the conventional welding process for electricalconnection, such that the electrical connection of the present inventionwill be more stable comparing with the conventional one. In particular,the engraving circuit 296 is formed by forming an engraving groove atthe mold sealer 2201 and metal-plating the engraving groove.

According to the first embodiment, the driver 30 can be electricallyconnected to the molded photosensitive assembly 20 by the motorconnecting unit 29, such as via the first connecting wire 291. Theconnection of the driver 30 can also be shown in FIGS. 7A, 7B and 7C.For example, the connection of the drive 30 is formed via the firstterminal slot 292 and the second connecting wire 293, the secondterminal slot 294 and the circuit terminal 295. In another embodiment asshown in FIG. 6B, the driver 30 can be connected to the moldedphotosensitive assembly 20 via the conventional method such as welding.Person skilled in the art should understand that the way to connect thedriver 30 and the molded photosensitive assembly 20 should not belimited in the present invention.

FIG. 8 illustrates an alternative mode of the array imaging module ofpresent invention. The array imaging module can be a fixed focus cameramodule which comprises a molded photosensitive assembly 20, two lightfilters 40, and two optical lenses 10.

The light filters 40 are installed at the molded photosensitive assembly20, wherein the optical lenses 10 are installed on the moldedphotosensitive assembly 20.

In particular, the light filters 40 are coupled at the coupling slots2741 of the light filter mounting portion 274 of the mold sealer 27respectively. The optical lenses 10 are coupled at the top side of themold sealer 27.

It is worth mentioning that the optical lenses 10 are coupled at the topside of the mold sealer 27 of the molded photosensitive assembly 20,such that the mold sealer 27 also serves as a supporter to support andretain the optical lenses 10 in position. However, the assembly of thearray imaging module is different from the conventional COB process. Theconventional COB process is that the supporting frame is adhered on thecircuit board. In view of the present invention, the mold sealer 27 ismolded and sealed at the circuit board 22, such that no adhering step isinvolved in the present invention to enhance the stability of theconnection and controllability of the process. Since the mold sealer 27is molded on the circuit board 22 to enclose the one or more electronicelements 26, there is no need to reserve any installing clearancebetween the mold sealer 27 and the electronic element 26, such that thethickness of the array imaging module will be reduced. In addition, theelectronic elements 26 and the lead wires 24 are able to be overlappedlyembedded in the mold sealer 27, wherein the electronic elements 26 andthe lead wires 24 can be shared with the common area. Unlike theconventional camera module, the electronic elements and the wires mustkeep a predetermined safety distance with each other. Accordingly, theheight of the mold sealer 27 that also provides the supporting functioncan be reduced. In addition, since the mold sealer 27 can replace theconventional supporting frame, the mold sealer 27 can minimize the tilterror so as to reduce the cumulative tolerance of the array imagingmodule. Moreover, since the lead wires 24 are enclosed by the moldsealer 27 and the mold sealer 27 is extended to the non-photosensitivearea 213 of the photosensitive unit 21, the size of the mold sealer 27can be reduced to further reduce the length and width size of the arrayimaging module.

FIG. 9 illustrates a second preferred embodiment of the array imagingmodule and its photosensitive units of the present invention. Thedifference between this second embodiment and the above embodiment isthat, the circuit board 22H has two inner indentation grooves 2222H,wherein the photosensitive units 21 are received in the innerindentation grooves 2222H to enclose the photosensitive units 21therewithin, so as to reduce the relative height difference between thephotosensitive units 21 and the circuit board 22H. Therefore, when themold sealer 27 is molded to enclose the photosensitive units 21, theheight of the mold sealer 27 will be reduced to minimize the height ofthe array imaging module.

FIG. 10 illustrates a third preferred embodiment of the array imagingmodule and its photosensitive units of the present invention.

The difference between this third preferred embodiment and the aboveembodiments is that, the molded photosensitive assembly 20 furthercomprises a reinforcing layer 2801 overlapped and coupled at the bottomside of the circuit board 22 to enhance the strength of the circuitboard 22. In other words, the reinforcing layer 2801 is overlapped andcoupled at the bottom side of the circuit board 22 at the area where themold sealer 27 and the photosensitive unit 21 are coupled on the topside of the circuit board 22, so as to ensure the strength of thecircuit board 22 to support the mold sealer 27 and the photosensitiveunit 21.

In addition, the reinforcing layer 2801 can be a metal panel coupled atthe bottom side of the circuit board 22 not only to enhance the strengthof the circuit board 22 but also to enhance the heat dissipating powerof the molded photosensitive assembly 20 to effectively dissipate heatgenerated by the photosensitive unit 21.

It is worth mentioning that the circuit board 22 can be a Flex PrintCircuit (FPC). Through the rigidities of the reinforcing layer 2204C andthe circuit board 22, the flex print circuit, having a bendable ability,can fulfill the supportive ability of the molded photosensitive assembly20. Accordingly, the circuit board 22 can be the Print Circuit Board(PCB), the FPC, or Rigid Flex (RF). In other words, the reinforcinglayer 2801 can substantially increase the strength of the circuit board22 and effectively enhance the heat dissipation, so as to reduce thethickness of the circuit board 22. Therefore, the height of the circuitboard assembly will be substantially reduced to minimize the height ofthe array imaging module.

As shown in FIGS. 10B and 10C, the circuit board 22 has at least areceiving chamber 224, wherein the photosensitive unit 21 is received inthe receiving chamber 224 of the circuit board 22 to minimize the heightdifference between the top side of the photosensitive unit 21 and thetop side of the circuit board 22. Preferably, the top side of thephotosensitive unit 21 and the top side of the circuit board 22 arealigned with the same planar direction. Therefore, the height of thearray imaging module can be further reduced. The array imaging modulecan be incorporated with the thinness of the electronic device. It isworth mentioning that the receiving chamber 224 can be a receiving slot,as shown in FIG. 10B. As shown in FIG. 10C, the receiving chamber 224can be a receiving through hole, wherein when the photosensitive units21 are electrically connected to the circuit board 22, thephotosensitive units 21 are disposed in the receiving chamber 224 andthe reinforcing layer 2081 is coupled at the bottom side of the circuitboard 22 to enhance the strength of the circuit board 22.

FIG. 11 illustrates a fourth preferred embodiment of the array imagingmodule and its photosensitive units of the present invention.

The difference between this fourth embodiment and the above embodimentsis that, the circuit board 22 further has at least a reinforcing slot220J, wherein the mold sealer 27 is extended into the reinforcing slot220J to enhance the strength of the circuit board 22.

The position of each of the reinforcing slots 220J can be selectivelymodified according to the rigidity of the circuit board 22. Preferably,the reinforcing slots 221J are symmetrically formed on the circuit board22. Accordingly, the rigidity of the circuit board 22 can be enhanced bythe reinforcing slot 220J to reduce the thickness of the circuit board22, so as to reduce the thickness of the array imaging module and toenhance the heat dissipation of the molded photosensitive assembly 20.

It is worth mentioning that the reinforcing slot 220J is embodied as anindention cavity, wherein the reinforcing slot 227D is not a throughslot, such that when the reinforcing slot 220J is formed on the circuitboard 22, the reinforcing slot 220J will not extended through thecircuit board 22. Therefore, the mold sealer 27 will not be extendedthrough the circuit board 22 and will not be leaked from the reinforcingslot 220J.

As shown in FIG. 12, an array imaging module with its moldedphotosensitive assembly 20 according to a fifth preferred embodiment ofthe present invention is illustrated.

The difference between this fifth preferred embodiment and the aboveembodiments is that, the circuit board 22 has a least a reinforcing slot220K, wherein the mold sealer 27 is extended into the reinforcing slot220K to enhance the strength of the circuit board 22.

The positions of each of the reinforcing slots 220K can be selectivelymodified according to the rigidity of the circuit board 22. Preferably,the reinforcing slots 220K are symmetrically formed on the circuit board22. Accordingly, the rigidity of the circuit board 22 can be enhanced bythe reinforcing slot 220K to reduce the thickness of the circuit board22, so as to reduce the thickness of the array imaging module and toenhance the heat dissipation of the molded photosensitive assembly 20.

It is worth mentioning that the reinforcing slot 220K is a through slot,such that when the reinforcing slot 220K is formed on the circuit board22, the reinforcing slot 220K will extended through the circuit board22. The two opposite sides of the circuit board 22 are communicate witheach other through the reinforcing slot 220K. Therefore, the mold sealer27 will be extended through the circuit board 22 to integrally form withthe circuit board 22 so as to combine the mold sealer 27 with thecircuit board 22 with a composite material structure. In addition, thereinforcing slot 220K as the through slot can be easily formed on thecircuit board 22.

As shown in FIG. 13, an array imaging module with its moldedphotosensitive assembly 20 according to a sixth embodiment of thepresent invention is illustrated.

The difference between this sixth preferred embodiment and the aboveembodiments is that, the mold sealer 27L has a least an enclosingportion 273L, a light filter mounting portion 274L, and a lens mountingportion 275L. The light filter mounting portion 274L and the lensmounting portion 275L are integrally formed with the enclosing portion273L in a sequent manner during the molding process, such that the lightfilter mounting portion 274L is integrally formed between the enclosingportion 273L and the lens mounting portion 275L. The enclosing portion273L is molded and formed to couple with the circuit board 22 and toenclose the electronic element 26 and the lead wires 24. The lightfilter mounting portion 274L is molded and formed to couple with thelight filter 40. In other words, during the manufacturing process of themolded photosensitive assembly 20 for the array imaging module, thelight filter 40 is mounted and supported at the light filter mountingportion 22014L, such that the light filter 40 is automatically retainedalong the photosensitive path of the photosensitive unit 21 withoutincorporating any conventional supporting frame. Therefore, the lightfilter mounting portion 274L has a supportive ability. Due to themolding process, the top side of the light filter mounting portion 274Lcan be made to have a flat surface to evenly support the light filter40, which is superior than the conventional camera module. The lensmounting portion 275L is coupled to the optical lens 10. In other words,during the manufacturing process of the molded photosensitive assembly20 for the array imaging module, the optical lens 10 can be mounted andsupported at the inner side of the lens mounting portion 275L, so as tostably retain the optical lens 10 in position.

The mold sealer 27L comprises a connecting body 271L and two outer ringbodies 272L, wherein the connecting body 271L is mold-connected betweenthe two outer ring bodies 272L to spacedly separate the outer ringbodies 272L by the connecting body 271L. Accordingly, each of the outerring bodies 272L forms the corresponding optical window 231L. The twophotosensitive units 21 are positioned at two lateral sides of theconnecting body 271L to form the array imaging module. It is worthmentioning that the connecting body 271L serves as a common body orsharing body that when installing the optical lenses 10, the opticallenses 10 will take even portions of the connecting body 271L.

Furthermore, the light filtering portion 274L has two mounting grooves2741L are spacedly formed at the light filtering portion 274L, whereinthe two mounting grooves 2741L are located corresponding to the opticalwindow 231L. The mounting grooves 2741L provide a mounting space,wherein a peripheral edge of the light filter 40 is engaged with themounting grooves 2741L, such that the light filter 40 can be stablymounted at the mold sealer 27L.

In other words, the light filter mounting portion 274L and the lensmounting portion 275L are extended integrally and upwardly to form astep-like platform at the inner sides thereof to stably support thelight filter 40 and the optical lens 10 without any addition supportingframe to support thereof.

The lens mounting portion 275L further has two lens inner walls 2752L,wherein each of the lens inner walls 2752L has a closed annular shape,such that a lens edge gap is formed between the lens inner walls 2752L.It is worth mentioning that each of the lens inner walls 2752L is a flatsurface to couple with the optical lens 10 without any threadedstructure, so as to form the fixed focus lens module. It is worthmentioning that the optical lens 10 can be coupled at the lens mountingportion 275L by adhesive.

As shown in FIG. 14, an array imaging module with its moldedphotosensitive assembly 20 according to a seventh embodiment of thepresent invention is illustrated. Unlike the above embodiments, themolded photosensitive assembly 20 further comprises a shielding layer290 that encloses the circuit board 22 and the mold sealer 27 to enhancethe strength of the circuit board 22 and to prevent any electromagneticinterference of the molded photosensitive assembly 20.

As shown in FIG. 14, an array imaging module and photosensitive unitsaccording to a seventh embodiment of the present invention isillustrated. The difference between this seventh preferred embodimentand the above embodiments is that, the molded photosensitive assembly 20comprises a shelter layer 290 for enclosing the circuit board 22 and themold sealer 27, so as to not only reinforce the strength of the circuitboard 20, but also enhance the anti-electromagnetic interference abilityof the molded photosensitive assembly 20.

As shown in FIGS. 15 and 16, an array imaging module and photosensitiveunits according to an eighth embodiment of the present invention isillustrated, wherein the array imaging module comprises a moldedphotosensitive assembly 20N, wherein the optical lens 10 is installed ontop of the molded photosensitive assembly 20 to form the array imagingmodule.

In particular, the optical lens 10 is adhered to affix on the top sideof the mold sealer 27N of the molded photosensitive assembly 20. Takingadvantage of the molding technology, the top side of the molded sealer27N provides a flat surface for stably supporting the optical lens 10thereon for enhancing the imaging quality of the array imaging module.The molded photosensitive assembly 20N is used to assemble tomanufacture the array imaging module for making the molded cameramodule.

The molded photosensitive assembly 20N comprises the mold sealer 27N andthe photosensitive device 28N, wherein the mold sealer 27N is molded andintegrally formed with the photosensitive device 28N.

The photosensitive device 28N comprises at least a circuit board 27N.The mold sealer 27N has two optical windows 231N, wherein the moldsealer 27N is formed at an outer periphery of the photosensitive unit21N. Two optical lenses 10 are located along optical paths of thephotosensitive units 21N respectively. In particular, the optical lenses10 are supported at the optical windows 231N of the mold sealer 27Ncorresponding to the locations of the circuit board 22N.

The mold sealer 27N comprises a connecting body 271N and two outerannular bodies 272N, wherein the connecting body 271N is integrallyextended between the outer annular bodies 272N to separate outer annularbodies 272N into two adjacent portions, such that the optical windows231N are defined at the outer annular bodies 272N respectively, whereinthe two photosensitive units 21N are positioned at two sides of theconnecting body 271N respectively so as to enable the assembling of thearray imaging module. It is worth mentioning that the connecting body271N serves as a common sharing portion for the drivers 30, such thatwhen the drivers 30 are coupled at the connecting body 271N of the moldsealer 27N, at least a portion of each of the drivers 30 will beassembled at different position of the connecting body 271N.

The photosensitive device 28N comprises at least a circuit board 22N andat least two photosensitive units 21N which are electrically coupled atthe circuit board 22N. According to the preferred embodiment, thephotosensitive units 21N are molded to connect with the circuit board22N.

According to the preferred embodiment, the photosensitive device 28Ncomprises a connecting circuit (not shown in the drawings) and at leastan electronic element 26N. The connecting circuit is pre-formed on thecircuit board 22N. The electronic element 26N is electrically connectedto the connecting circuit to couple at the circuit board 22N, whereinthe electronic element 26N is electrically connected to thephotosensitive units 21N for operating the photosensitive process of thephotosensitive units 21N. The electronic element 26N is outwardlyprotruded from the circuit board 22N. The electronic element 26N can be,but not limit to, a resistor, a capacitor, a diode, a triode, apotentiometer, a relay, a processor, or a driver.

It is worth mentioning that the electronic element 26N is enclosed bythe mold sealer 27N to prevent the exposure of the electronic element 26to outside. In other words, the electronic element 26N is hidden withinthe mold sealer 27N to prevent any contamination, such as dust, from thesurroundings during the operation of the array imaging module. Unlikethe conventional camera module, the electronic element 26N, such as thecapacitor, are exposed to the surroundings. Therefore, the mold sealer27N of the present invention can prevent any dust or residue remainingat the surface of the electronic element 26N to contaminate thephotosensitive unit 21N which may cause adverse effect such as blackspot and the like on the image.

According to the preferred embodiment, the photosensitive device 28Nfurther comprises a plurality of lead wires 24N for electricallyconnecting to the photosensitive units 21N and the circuit board 22N. Inparticular, the lead wire 24N can be, but not limit to, gold wire,aluminum wire, copper wire, or silver wire.

It is worth mentioning that each of the lead wires 24N is embedded inthe mold sealer 27N, wherein the lead wires 24N are enclosed by the moldsealer 27N, so as to prevent the exposure of the lead wires 24N tooutside. When assembling the array imaging module, the lead wires 24Nwill not be damaged by any external contact or any external factor, suchas temperature. Therefore, the lead wires 24N can effectively and stablytransmit signals between the photosensitive units 21N and the circuitboard 22N. The embedded lead wires 24N of the present invention aresuperior than the exposed wires of the conventional camera module.

It is worth mentioning that the electronic element 26N and the leadwires 24N are enclosed by the mold sealer 27N, such that the electronicelement 26N and the lead wires 24N are protected by the mold sealer 27Nfor enabling the camera module to achieve better performance. Personskilled in the art should understand that the mold sealer 27N is notlimited to enclose the electronic element 26N and the lead wires 24N. Inother words, according to other embodiments, the mold sealer 27N can bedirectly molded and formed at the circuit board 22N while the electronicelement 26N is embedded in the circuit board 22N without protruding onthe circuit board 22N. In addition, the mold sealer 27N can also formedat different locations of the electronic element 26N, such as at anouter periphery of the electronic element 26N or surrounding theelectronic element 26N.

Furthermore, the photosensitive unit 21N has a photosensitive area 212Nand a non-photosensitive area 213N, wherein the photosensitive area 212Nis encircled within the non-photosensitive area 212N and is arranged forproviding photosensitive effect. The lead wire 24N is operatively linkedto the non-photosensitive area 213N.

According to the preferred embodiment, the mold sealer 27N is extendedto the non-photosensitive area 213N of the photosensitive unit 21N andis overlappedly coupled at the circuit board 22N via the moldingprocess. Through the molding process, such as Molding on Chip (MOC)method, the covering area of the mold sealer 27N can be enlarged at itsinward direction, so as to reduce the outward extension of the moldsealer 27N. As a result, the length and width of the mold sealer 27N canbe reduced to minimize the size of the array imaging module.

The molded photosensitive assembly 20N further comprises two lightfilters 40N overlappedly coupled above the photosensitive units 21N. Aperiphery of each of the light filters 40N is coupled at the mold sealer27N to retain the light filter 40N in position. It is worth mentioningthe light filters 40N cover on top of the photosensitive units 21Nrespectively to protect and separate the photosensitive units 21N fromoutside so as to prevent any damage of the photosensitive units 21N.

During the manufacturing process of the molded photosensitive assembly20N, the photosensitive units 21N are initially formed at the circuitboard 22N by, for example, attaching on the circuit board 22N, such thatthe photosensitive units 21N are electrically connected to the circuitboard 22N via the lead wires 24N. Then, the light filters 40N arepositioned on top of the photosensitive units 21N. Furthermore, thecircuit board 22N, the photosensitive units 21N, and the light filters40N are treated by molding process to form the integral mold sealer 27N.During the mold processing, the light filters 40N cover on top of thephotosensitive units 21N to prevent damage of the photosensitive units21N. Since the distance between the light filters 40N and thephotosensitive units 21N is reduced, a focal length of the array imagingmodule is reduced, resulting in minimizing the height of the arrayimaging module. In addition, the light filters 40N do not require anyadditional support that further reduces the thickness of the arrayimaging module.

According to the preferred embodiment, the mold sealer 27N isprotrudedly encircled around an outer periphery of the photosensitivearea 212N of the photosensitive unit 21N. In particular, the mold sealer27N is integrally connected to the photosensitive unit 21N to provide asealing effect therefor. In other words, when the molded photosensitiveassembly 20N is assembled, the photosensitive device is sealed andenclosed therewithin to form a closed environment.

In particular, during the manufacturing process of the moldedphotosensitive assembly 20N, the circuit board 22N, which can be aconventional circuit board, can be used for supporting the twophotosensitive units 21N, such as coupling the two photosensitive units21N on the circuit board 22N. Then, the two photosensitive units 21N canbe electrically connected to the circuit board 22N via the lead wires24N. Then, the light filters 40N are overlappedly coupled on top of thephotosensitive units 21N. Then, the photosensitive units 21N and thecircuit board 22N can be initially packed and sealed for moldingprocess. For example, by using a mold injection machine for introducingor injecting mold material via Insert Molding technology and SurfaceMount Technology to mold and form the mold sealer 27N or via asemiconductor packaging technology and press mold technology to mold andform the mold sealer 27N. The circuit board 22N can be, but not limitedto, a soft-hard combination board, ceramic substrate (non-flexibleboard), or a hard PCB board (non-flexible board). The molding processcan be, but not limit to, the injection molding process or press-moldingprocess. The injection mold material can be nylon, LCP (Liquid CrystalPolymer), PP (Polypropylene), or the like. It is appreciated thatdifferent materials can be selectively used in different moldingprocesses and should not be restricted in the present invention. Theprocess of forming the mold sealer 27N should not be restricted in thepresent invention.

As shown in FIG. 17, an array imaging module according to a ninthpreferred embodiment of the present invention is illustrated. Thedifference between this ninth preferred embodiment and the aboveembodiments is that, the array imaging module further comprises at leasta supporter 70 for installing the light filter 40 s, the optical lenses10, and drivers 30. Accordingly, the supporter 70 is coupled at the moldsealer 27, wherein the light filters 40 are supported by the supporter70, the optical lenses 10 are supported by the supporter 70, and thedrivers 30 are supported by the supporter 70. The shape of the supporter70 can be selectively modified. For example, the supporter 70 forms aprotruding platform for supporting the light filter 40. The supporter 70can be a multiple supporter to support two or more light filters 40 atthe same time. Likewise, the supporter 70 can be a single supporter tosupport one single light filter 40. According to the preferredembodiment, the supporter 70 is the multiple supporter. It isappreciated that the shape of the supporter 70 should not be limited inthe present invention.

FIGS. 18 to 26 illustrates another preferred embodiment of the arrayimaging module of the present invention, which comprises at least twooptical lenses 10′ and a molded photosensitive assembly 20′. The moldedphotosensitive unit 20′ comprises at least two photosensitive units 21′,at least a circuit board 22′, at least a molded base 23′, and at leasttwo sets of lead wires 24′.

Each of the photosensitive units 21′ comprises a chip connector 211′ andhaving a photosensitive area 212′ and a non-photosensitive area 213′,wherein the photosensitive area 212′ and the non-photosensitive area213′ are defined at the same face of the photosensitive units 21′. Inparticular, the photosensitive area 212′ are defined within orsurrounded by the non-photosensitive area 213′. In other words, thephotosensitive area 212′ is defined at a center of thenon-photosensitive area 213′, wherein the non-photosensitive area 213′encircles around the photosensitive area 212′. The chip connector 211′is located at the non-photosensitive area 213′.

Correspondingly, the circuit board 22′ comprises at least two sets ofcircuit connectors 221′ and has at least two chip coupling areas 222′and a peripheral area 223′, wherein the chip coupling areas 222′ and theperipheral area 223′ are integrally formed at a position that peripheralarea 223′ is defined at a periphery of each of the chip coupling areas222′. The circuit connectors 221′ are located at the peripheral area223′.

Each of the lead wires 24′ has a chip connecting terminal 241′ and acircuit board connecting terminal 242′, wherein each of the lead wire24′ has a curved configuration between the chip connecting terminal 241′and the circuit board connecting terminal 242′.

The photosensitive units 21′ are coupled at the chip coupling areas 222′of the circuit board 22′ respectively, wherein the chip connectingterminal 241′ of the lead wire 24 is electrically connected to the chipconnector 211′ of the photosensitive units 21′. The circuit boardconnecting terminal 242′ of the each of the lead wires 24′ iselectrically connected to the circuit connector 221′ of the circuitboard 22′. The molded base 23′ is integrally coupled at the peripheralarea 223′ of the circuit board 22′ to form the molded photosensitiveassembly 20′. The optical lenses 10′ are coupled at the moldedphotosensitive assembly 20′ along the photosensitive paths of thephotosensitive units 21′ respectively. When the light is reflected froman object and passes through the optical lenses 10′, the light willenter into the interior of the array imaging module to thephotosensitive areas 212′ of the photosensitive units 21′. Then, thephotosensitive units 21′ will convert the light signal into the electricsignal for obtaining the image of the object through the photoelectricconversion process.

In one embodiment, each of the chip connector 221′ of the photosensitiveunits 21′ and the circuit connector 221′ of the circuit board 22′ can bea connecting tray. In other words, each of the chip connector 221′ ofthe photosensitive units 21′ and the circuit connector 221′ of thecircuit board 22′ has a tray configuration. Therefore, the chipconnecting terminal 241′ of the lead wires 24 can be easily connected tothe chip connector 211′ of the photosensitive units 21′. The circuitboard connecting terminal 242′ of each of the lead wires 24′ can beeasily connected to the circuit connector 221′ of the circuit board 22′.In another embodiment, each of the chip connector 221′ of thephotosensitive units 21′ and the circuit connector 221′ of the circuitboard 22′ has a spherical shape, such as applying a paste or otherwelding materials as a connection point at each of thenon-photosensitive area 213′ of the photosensitive units 21′ and theperipheral area 223′ of the circuit board 22′ in order to form each ofthe chip connector 221′ of the photosensitive units 21′ and the circuitconnector 221′ of the circuit board 22′. It is appreciated that theabove examples are illustrative only that each of the chip connector221′ of the photosensitive units 21′ and the circuit connector 221′ ofthe circuit board 22′ can be formed by different ways.

The non-photosensitive area 213′ of the photosensitive units 21′ has achip inner lateral side 2131′, a chip connecting portion 2132′, and achip outer lateral side 2133′. The chip connector 211′ is located at thechip connecting portion 2132′. The chip inner lateral side 2131′ isextended and encircled around the photosensitive area 212′. Two lateralsides of the chip connecting portion 2132′ is extended to the chip innerlateral side 2131′ and the chip outer lateral side 2133′ respectively.In other words, the chip inner lateral side 2131′ is defined between thenon-photosensitive area 213′ where of the chip connector 211′ is locatedand the edge of the photosensitive area 212′. The chip connectingportion 2132′ is defined at the non-photosensitive area 213′ where ofthe chip connector 211′ is located. The chip outer lateral side 2133′ isdefined between the non-photosensitive area 213′ where of the chipconnector 211′ is located and an outer edge of the photosensitive units21′. In other words, at the top view of the photosensitive units 21′,the photosensitive area 212′, the chip inner lateral side 2131′, a chipconnecting portion 2132′, and a chip outer lateral side 2133′ are formedin sequence from an inner side of the photosensitive units 21′ to anouter side thereof.

Correspondingly, the peripheral portion 223′ of the circuit board 22′has a circuit board inner lateral side 2231′, a circuit board connectingportion 2232′, and a circuit board outer lateral side 2233′. The circuitconnector 221′ is coupled at the circuit board connecting portion 2232′.The circuit board inner lateral side 2231′ is extended and encircledaround the chip coupling area 222′. Two lateral sides of the circuitboard connecting portion 2232′ are extended to the circuit board innerlateral side 2231′ and the circuit board outer lateral side 2233′respectively. In other words, the circuit board inner lateral side 2231′is defined between the peripheral area 223′ where of the circuitconnector 221′ is located and the edge of the chip coupling area 222′.The circuit board connecting portion 2232′ is defined at peripheral area223′ where of the circuit connector 221′ is located. The circuit boardouter lateral side 2233′ is defined between the peripheral area 223′where of the circuit connector 221′ is located and an outer edge of thecircuit board 22′. It is worth mentioning that the circuit board 22′ isa one-piece integrated body. Preferably, the chip coupling areas 222′are symmetrically formed at two side ends of the circuit board 22′, suchthat the circuit board 22′ has a symmetrical configuration andstructure.

In addition, the material and type of the lead wire 24′ of the arrayimaging module should not be limited in the present invention. Forexample, the lead wire 24′ can be a gold wire, such that thephotosensitive units 21′ can be electrically connected to the circuitboard 22′ via the gold wire. In addition, the photosensitive area 212′of the photosensitive units 21′ is able to convert light signal intoelectric signal, wherein the electric signal can transmit to the circuitboard 22′ via the lead wire 24′. Accordingly, the lead wire 24′ can be asliver wire, copper wire, or the like in order to transmit the electricsignal from the photosensitive units 21′ to the circuit board 22′.

The array imaging module of the present invention can be a fixed-focuscamera module, an auto-focus camera module, or zoom camera module. Forexample, the array camera module can have the autofocus and optical zoomability under the controlled height restriction, so as to improve theimaging quality of the array imaging module. As shown in FIG. 24, thearray imaging module further comprises at least two drivers 30′, whereinthe drivers 30′ are operatively coupled to the optical lenses 10′respectively. Each of the drivers 30′ is supported and coupled at themolded base 23′ at the top side thereof to retain the optical lenses 10′at the optical paths of the photosensitive units 21′ of the moldedphotosensitive assembly 20′ respectively. Each of the drivers 30′ iselectrically coupled to the circuit board 22′, wherein after the circuitboard 22′ transmits the electric signal to each of the drivers 30′, eachof the drivers 30′ will drive the corresponding optical lens 10′ to movealong the photosensitive path of the corresponding photosensitive unit21′ for adjusting the focal point of the array imaging module. In otherwords, the optical lenses 10′ are driven to move by the drivers 30′respectively.

It is worth mentioning that the driver 30′ can be modified or selectedin different types without any limitation of the array imaging module ofthe present invention. For example, the driver 30′ can be a voice coilmotor for driving the optical lens 10′ along the optical path of thephotosensitive unit 21′, wherein the driver 30′ is able to receive theelectric signal and control signal for operation.

As shown in FIG. 24, the array imaging module further comprises at leasta light filter 40′. In one embodiment, the present invention comprisesat least a lighter filter 40′, wherein the light filter 40′ is coupledat the top side of the molded base 23′, such that the light filter 40′can be located at different positions corresponding to the optical pathof the photosensitive unit 21′. In another embodiment, the array imagingmodule further comprises two or more light filters 40′, wherein thelight filters 40′ are coupled at the top side of the molded base 23′,such that the light filters 40′ can be located corresponding to theoptical paths of the photosensitive units 21′. In other words, thephotosensitive units 21′, the light filters 40′, and the optical lenses10′ are coupled respectively.

During the operation of the array imaging module, the light reflected bythe object is guided to pass through the optical lens 10′ into theinterior of the array imaging module. Then, the light will pass throughthe light filter 40′ to the photosensitive unit 21′, such that thephotosensitive unit 21′ will receive the reflected light along theoptical path for photoelectric conversion. Accordingly, the light filter40′ is arranged for filtering stray light, such as the infrared lightportion, in the light from the optical lens 10′ for improving theimaging quality of the array imaging module.

In addition, the light filter 40′ is directly coupled at the top side ofthe molded base 23′. Alternatively, the light filter 40′ can be coupledat a supporter which is coupled at the top side of the molded base 23′,such that the light filter 40′ is coupled at the top side of the moldedbase 23′ via the supporter. Therefore, the size of the light filter 40′can be reduced to minimize the manufacturing cost of the array imagingmodule.

According to the present invention, the light filter 40′ can be formedin different types for different implements of the array imaging module.For example, the light filter 40′ can be an infrared cut-off filter, afull transmissible spectral filter, other filters, or two or moredifferent light filters 40′. For example, the infrared cut filter andthe full transmissible spectral filter can form a combination of lightfiltering unit, such that the infrared cut filter and the fulltransmissible spectral filter can be selectively switched to locatealong the optical path of the photosensitive unit 21′. For example, theinfrared cut filter is selectively switched to locate along the opticalpath of the photosensitive unit 21′ when the array imaging module isoperated under the day light environment in which the environmentallight is sufficient. Therefore, the infrared light portion of the lightwill be filtered by the infrared cut filter when entering into theinterior of the array imaging module. Likewise, the full transmissiblespectral filter is selectively switched to locate along the optical pathof the photosensitive unit 21′ when the array imaging module is operatedunder the dark environment in which the environmental light isinsufficient. Therefore, the infrared light portion of the light willnot be filtered by the infrared cut filter when entering into theinterior of the array imaging module.

The molded photosensitive assembly 20′ further comprises at least asupporting member 25′, wherein the supporting member 25′ protects thelead wires 24′ and the photosensitive units 21′ during the moldingprocess. According to the preferred embodiment, at least two supportingmembers 25′ are provided. Preferably, the number of the supportingmember 25′ matches with the number of the photosensitive unit 21′.Before the mold sealer 23′ is formed, the non-photosensitive areas 213′of the photosensitive units 21′ are covered by the supporting members25′ respectively. After the mold sealer 23′ is formed, the mold sealer23′ will cover and enclose the peripheral areas 223′ of the circuitboard 22′, portions of the non-photosensitive areas 213′ of thephotosensitive units 21′, and portions of the supporting members 25′, soas to form the molded photosensitive assembly 20′. The supportingmembers 25′ can enhance the quality of the array imaging module and theimaging quality thereof. In another embodiment, there is only onesupporting member 25′ being used as disclosed later.

Each of the supporting members 25′ comprises an encircling frame shapedsupporting body 251′ and a through hole 252′, wherein the supportingbody 251′ of the supporting member 25′ is coupled on at least a portionof the non-photosensitive area 213′ of the photosensitive unit 21′. Thephotosensitive area 212′ of the photosensitive unit 21′ is aligned withthe through hole 252′ of the supporting member 25′. Preferably, thesupporting body 251′ of the supporting member 25′ is coupled on at leasta portion of each of the chip inner lateral side 2131′, the chipconnecting portion 2132′, and the chip outer lateral side 2133′ of thenon-photosensitive area 213′ of the photosensitive unit 21′. Inaddition, the supporting body 251′ of the supporting member 25′ has atop side 2501′, an inner lateral side 2502′, and an outer lateral side2503′. According to the preferred embodiment, the side of the supportingbody 251′ facing toward the photosensitive area 212′ is defined as theinner lateral side 2502′ of the supporting body 251′. The side of thesupporting body 251′ facing toward the peripheral area 223′ of thecircuit board 22′ is defined as the outer lateral side 2503′ of thesupporting body 251′. In one embodiment, the mold sealer 23′ is formedto enclose at least a portion of each of the outer lateral side 2503′and the top side 2501′ of the supporting body 251′.

In addition, the molded photosensitive assembly 20′ further comprisesone or more electronic elements 26′ which are treated by Surface MountTechnology (SMT) to electrically couple at the peripheral portion 223′of the circuit board 22′. Preferably, each of the electronic elements26′ is electrically coupled at the peripheral portion 223′ of thecircuit board 22′ at the circuit board outer lateral side 2233′ thereof.Accordingly, the photosensitive unit 21′ and the electronic elements 26′can be coupled at the same side of the circuit board 22′ or two opposedsides of the circuit board 22′. For example, the photosensitive unit 21′and the electronic elements 26′ can be coupled at the same side of thecircuit board 22′ in one embodiment, wherein the photosensitive unit 21′is coupled at the chip coupling areas 222′ of the circuit board 22′ andthe electronic elements 26′ are coupled at the peripheral area 223′ ofthe circuit board 22′. When the mold sealer 23′ is formed to enclose theperipheral area 223′ of the circuit board 22′, the mold sealer 23′ willenclose the electronic elements 26′. Therefore, the electronic elements26′ are individually isolated and are separated from the photosensitiveunit 21′. Accordingly, even though the distance between two adjacentelectronic elements 26′ is reduced, the mold sealer 23′ can prevent themutual interference by the adjacent electronic elements 26′. Since themold sealer 23′ encloses all the electronic elements 26′ to prevent theelectronic elements 26′ from exposing and contacting with outside so asto prevent any contaminate the photosensitive area 212′ of thephotosensitive unit 21′. In other words, the size of the array imagingmodule can be further reduced and the imaging quality of the arrayimaging module can be enhanced. Therefore, through the enclosing of theelectronic elements 26′ within the mold sealer 23′, the area of thecircuit board 22′ can be further reduced and more electronic elements26′ can be electrically coupled at the circuit board 22′ with a limitedinstalling area. The electronic element 26′ can be, but not limit to, aresistor, a capacitor, a diode, a triode, a potentiometer, a relay, aprocessor, or a driver.

It is worth mentioning that the mold sealer 23′, the photosensitive unit21′, and the circuit board 22′ are combined to form an integratedstructure, the mold sealer 23′ will serves as a reinforcing portion toreinforce the structure of the circuit board 22′. In other words, themold sealer 23′ will enhance the strength of the circuit board 22′ afterthe circuit board 22′ is coupled with the mold sealer 23′. Even though athinner circuit board 22′ is used, the circuit board 22′ will not beeasily deformed when the strength of the circuit board 22′ is enhancedby the mold sealer 23′. Therefore, the imaging quality of the arrayimaging module can be enhanced.

When the photosensitive unit 21′ is coupled at and is electricallyconnected with the circuit board 22′, the mold sealer 23′ is molded andformed thereon, such that the mold sealer 23′ forms a reinforcingportion of the circuit board 22′. Therefore, during the manufacturingprocess, the mold sealer 23′ will reinforce the circuit board 22′ toprevent the deformation of the circuit board 22′, so as to enhance theimaging quality of the array imaging module.

According to the preferred embodiment of the array imaging module, themold sealer 23′ forms the reinforcing portion of the circuit board 22′when the mold sealer 23′ is integrally formed with the circuit board22′, so as to reduce the cumulative tolerance of the array imagingmodule and to enhance the imaging quality of the array imaging module.

In addition, the photosensitive unit 21′, the circuit board 22′, and themold sealer 23′ are combined to form an integrated structure, theflatness of the photosensitive unit 21′ will not be restricted by theflatness of the circuit board 22′, such that a thinner circuit board22′, such as the flexible circuit board, can be used for reducing thethickness of the array imaging module.

FIGS. 18 to 24 illustrates the array imaging module as a dual lenscamera module. As shown in FIG. 18, the array imaging module can beformed as a multiple lens camera module having multiple optical lenses10′.

FIGS. 18 to 22 illustrate the manufacturing process of the moldedphotosensitive assembly 20′ of the array imaging module. FIGS. 23 to 25illustrate the manufacturing process of the array imaging module withthe molded photosensitive assembly 20′.

Referring to FIG. 18, the two photosensitive units 21′ are coupled atthe two chip coupling areas 222′ of the circuit board 22′ respectively,wherein the chip connectors 211′ of the photosensitive units 21′ areelectrically connected to the chip coupling areas 222′ of the circuitboard 22′ via the lead wires 24′ respectively. The electronic elements26′ are electrically connected at the peripheral area 223′ of thecircuit board 22′. The electronic elements 26′ are spaced apart fromeach other. Once the array imaging module is formed, the electronicelements 26′ will not be mutual interfered with each other.

Through the connection of the lead wire 24′ and its physical properties,the chip connecting terminal 241′ of the lead wire 24′ is electricallyconnected to the chip connector 211′ of the photosensitive unit 21′ andthe circuit board connecting terminal 242′ of the lead wire 24′ iselectrically connected to the circuit connector 221′ of the circuitboard 22′. Then, each of the lead wires 24′ is bent to protrude upwardlyabove the top side of the photosensitive unit 21′. It is appreciatedthat during the manufacturing process of the array imaging module, eachof the lead wires 24′ is retained at its original state to keep the bestelectrical conductivity of the lead wire 24′ so as to enhance theimaging quality of the array imaging module.

As shown in FIG. 19, at least a portion of the non-photosensitive area213′ of the photosensitive unit 21′ is enclosed by the respectivesupporting body 251′, wherein the photosensitive area 212′ of thephotosensitive unit 21′ is aligned with the through hole 252′ of therespective supporting member 25′. Therefore, the supporting members 25′,the photosensitive units 21′, the circuit board 22′, and the lead wires24′ form a semi-product of the array imaging module. According to thepreferred embodiment, at least a portion of each of the chip innerlateral side 2131′, the chip connecting portion 2132′, and the chipouter lateral side 2133′ of the photosensitive unit 21′ is enclosed bythe respective supporting body 251′. In other words, the supportingbodies 251′ will cover the connections of the chip connecting terminals241′ of the lead wires 24′ and the chip connectors 211′ of thephotosensitive units 21′. During the molding process, the supportingbodies 251′ will prevent the mold sealer 23′ contacting to theconnections of the chip connecting terminals 241′ of the lead wires 24′and the chip connectors 211′ of the photosensitive units 21′, so as toprevent any disconnect at the chip connecting terminals 241′ of the leadwires 24′ and the chip connectors 211′ of the photosensitive units 21′.

Since the supporting bodies 251′ cover the connections of the chipconnecting terminals 241′ of the lead wires 24′ and the chip connectors211′ of the photosensitive units 21′, the chip connecting terminals 241′of the lead wires 24′ and the chip connectors 211′ of the photosensitiveunits 21′ can be separated by the supporting bodies 251′. During themolding process, the supporting bodies 251′ will prevent the deformationof the chip connecting terminals 241′ of the lead wires 24′ and the chipconnectors 211′ of the photosensitive units 21′, and will prevent anydisconnect at the chip connecting terminals 241′ of the lead wires 24′and the chip connectors 211′ of the photosensitive units 21′.

In addition, a portion of each of the lead wires 24′ is enclosed by therespective supporting body 251′, such that the lead wires 24′ areretained in position by the supporting bodies 251′. In other words, thelead wires 24′ will not be deformed during the molding process.Therefore, the supporting bodies 251′ can prevent each of the lead wires24′ from being deformed to contact with the neighboring lead wires 24′which may cause the short circuit, so as to ensure the quality of thearray imaging module.

In one embodiment, the supporting body 251′ is formed by adhesive tocouple at the non-photosensitive area 213′ of the respectivephotosensitive unit 21′, such that when the adhesive is solidified, thesupporting body 251′ provides a predetermined elasticity. Once thesupporting body 251′ is formed, the inner lateral side 252′ of thesupporting body 251′ forms the through hole 252′ of the supportingmember 25′, such that the photosensitive area 212′ of the photosensitiveunit 21′ is aligned with the through hole 252′ of the supporting member25′. In addition, since the supporting body 251′ can be formed byadhesive to have a predetermined adhering ability, contaminants, such asdust or residue, can be adhered onto the supporting body 251′ so as toprevent the contamination of the photosensitive area 212′ of thephotosensitive unit 21′ for enhancing the imaging quality of the arrayimaging module. For example, the supporting body 251′ is formed betweenthe electronic element 26′ and the photosensitive area 212′ of thephotosensitive units 21′, such that the contaminants, such as weldingpowders, from the welding process of the electronic element 26′ on thecircuit board 22′ will be adhered by the supporting body 251′, so as toprevent contamination of the photosensitive area 212′ of thephotosensitive unit 21′.

Preferably, the supporting body 251′ is formed by applying the adhesiveon the non-photosensitive area 213′ of the photosensitive units 21′,such that when the adhesive is solidified, the shape of the supportingbody 251′ is retained at the non-photosensitive area 213′ of thephotosensitive units 21′ to prevent the supporting body 251′ fromflowing to the photosensitive area 212′ of the photosensitive unit 21′so as to prevent contamination of the photosensitive area 212′ of thephotosensitive unit 21′. In other words, the shape of the supportingbody 251′ can be adjustably modified via the solidification of theadhesive to prevent the deformation of the supporting body 251′ duringthe solidification process, so as to ensure the supporting body 251′being retained at the non-photosensitive area 213′ of the photosensitiveunits 21′. It is appreciated that after the connection between the chipconnecting terminals 241′ of the lead wires 24′ and the chip connectors211′ of the photosensitive units 21′ and the connection between thecircuit board connecting terminals 242′ of the lead wires 24′ and thecircuit connectors 221′ of the circuit board 22′, the chip connectingterminals 241′ of the lead wires 24′ are enclosed by the supportingbodies 251′ after the solidification of the adhesive, so as to preventthe chip connecting terminals 241′ of the lead wires 24′ during thesolidification process of the adhesive.

As shown in FIG. 20A, the molding process is operated by a mold 100′ toform the mold sealer 23′ after the mold material is solidified. Throughthe molding process, the size of the array imaging module is reduced andthe assembling error of the array imaging module can be minimized so asto configure the array imaging module to have a compact size and toimprove the imaging quality of the array imaging module.

In particular, the mold 100′ comprises an upper mold body 101′ and alower mold body 102′, wherein at least one of the upper mold body 101′and the lower mold body 102′ is movable and operable in a controllingmanner. When the upper mold body 101′ and the lower mold body 102′ areclosed and coupled with each other, at least two mold cavities 103′ areformed therewithin. Accordingly, the mold sealer 23′ is formed bysolidifying the mold material which is placed in or injected into themold cavities 103′.

In one embodiment, for example, the lower mold body 102′ is stationaryand the upper mold body 101′ is movable to couple towards the lower moldbody 102′ to close mold 100′, wherein the mold 100′ is opened by movingthe upper mold body 101′ away from the lower mold body 102′. When theupper mold body 101′ is moved downwardly to couple with the lower moldbody 102′ to close the mold 100′, the mold cavities 103′ are formedtherein. In another embodiment, the upper mold body 101′ is stationaryand the lower mold body 102′ is movable with respect to the upper moldbody 101′ along guiding posts, such that when the lower mold body 102′is moved upwardly to couple with the upper mold body 101′, the mold 100′is closed and the mold cavities 103′ are formed therein, and that whenthe lower mold body 102′ is moved downwardly away from the upper moldbody 101′, the mold 100′ is opened for drafting.

When the semi-product of the array imaging module is placed in the uppermold body 101′ and/or the lower mold body 102′, the mold 100′ is closedby coupling upper mold body 101′ with the lower mold body 102′ to formthe mold cavities 103′ therein. The mold engaging surface 1011′ of theupper mold body 101′ is pressed on the top side 2501′ of the supportingbody 251′, wherein the upper mold body 101′ is supported by thesupporting body 251′ to prevent the upper mold body 101′ being directlypressed against the lead wires 24′, so as to protect the lead wires 24′from being damaged during the molding process. It is worth mentioningthat the peripheral area 223′ of the circuit board 22′ of thesemi-product is set corresponding to the mold cavity 103′.

It is worth mentioning that each of the mold cavities 103′ forms anannular shape and the two mold cavities 103′ are communicated with eachother, such that the mold material filled in the mold cavities 103′forms the mold sealer 23′ after it is solidified.

Preferably, due to the elasticity of the supporting body 251′, thesupporting bodies 251′ will absorb the impact from the upper mold body101′ when the mold engaging surface 1011′ of the upper mold body 101′ ispressed on the top sides 2501′ of to the supporting bodies 251′, so asto prevent the impact force transmitting to the photosensitive units21′. In other words, the supporting bodies 251′ prevents thephotosensitive units 21′ from being damaged and to prevent thedislocation of the circuit board 22′ due to the impact force. It isappreciated that the supporting bodies 251′ not only absorb the impactforce to prevent the impact force transmitting to the photosensitiveunit 21′ but also ensure the photosensitive units 21′ coupled at thecircuit board 22′ with its flatness, so as to enhance the imagingquality of the array imaging module.

Preferably, in one embodiment, the height of each of the supportingbodies 251′ is higher than the height of the apex of the lead wires 24′as the lead wires 24′ being bent to protrude upwardly above the top sideof the photosensitive unit 21′. During the operation of the mold 100′,the mold engaging surface 1011′ of the upper mold body 101′ is pressedon the top sides 2501′ of the supporting bodies 251′. The top sides2501′ of the supporting bodies 251′ will bias against the upper moldbody 101′ to prevent the further downward movement of the upper moldbody 101′, so as to prevent the mold engaging surface 1011′ of the uppermold body 101′ from being pressed against the lead wires 24′. In otherwords, each of the supporting bodies 251′ creates a predetermined safetydistance between the mold engaging surface 1011′ of the upper mold body101′ and the lead wires 24′. In another embodiment, the height of eachof the supporting bodies 251′ is the same as the height of the leadwires 24′, wherein during the operation of the mold 100′, the moldengaging surface 1011′ of the upper mold body 101′ is merely contactedwith the lead wires 24′. However, the mold engaging surface 1011′ of theupper mold body 101′ cannot apply a substantial pressing force againstthe lead wires 24′.

In addition, due to the elasticity of the supporting body 251′, the moldengaging surface 1011′ of the upper mold body 101′ is pressed on the topsides 2501′ of the supporting bodies 251′ to slightly deform the topsides 2501′ of the supporting bodies 251′, so as to prevent any gapformed between the mold engaging surface 1011′ of the upper mold body101′ and the top sides 2501′ of the supporting bodies 251′. In otherwords, the mold engaging surface 1011′ of the upper mold body 101′ andthe top sides 2501′ of the supporting bodies 251′ are tightly engagedwith each other in a surface-to-surface engaging manner. As a result,the photosensitive areas 212′ of the photosensitive units 21′ throughthe through holes 252′ of the supporting members 25′ respectively willbe enclosed in a closed environment during the molding process.Therefore, when the mold material is introduced into the mold cavities103′, the mold material will not be entered into the closed environmentand contaminate the photosensitive area 212′ of the photosensitive unit21′. It is worth mentioning that the Shore A hardness of the supportingbody 251′ has a range between A50 and A80, and the elasticity of thesupporting body 251′ has a range between 0.1 Gpa and 1 Gpa.

In addition, during the molding process, the mold engaging surface 1011′of the upper mold body 101′ and the top sides 2501′ of the supportingbodies 251′ are tightly engaged with each other, to prevent the edgetrimming of the mold sealer 23′, so as to enhance the imaging quality ofthe array imaging module.

FIG. 20B illustrates an alternative mode of the manufacturing process ofthe molded photosensitive assembly 20′ according to the presentinvention, wherein the supporting body 251′ can be made of rigidmaterial. In other words, when the mold engaging surface 1011′ of theupper mold body 101′ is pressed on the top sides 2501′ of the supportingbodies 251′, the top sides 2501′ of the supporting bodies 251′ will notbe deformed, so as to enhance the electrical conductivity of the leadwires 24′ and to ensure the quality of the array imaging module and theimaging quality of the array imaging module. It is worth mentioning thatthe Shore A hardness of the supporting body 251′ is larger than A70, andthe elasticity of the supporting body 251′ is larger than 1 Fpa.

The mold 100′ further comprises an enclosing film 104′ provided at themold engaging surface 1011′ of the upper mold body 101′, wherein whenthe upper mold body 101′ and the lower mold body 102′ are coupled witheach other to close the mold 100′, the enclosing film 104′ is sandwichedbetween the mold engaging surface 1011′ of the upper mold body 101′ andthe top sides 2501′ of the supporting bodies 251′, so as to ensure thephotosensitive area 212′ of the photosensitive unit 21′ in a closedenvironment.

It is worth mentioning that when the enclosing film 104′ is sandwichedbetween the mold engaging surface 1011′ of the upper mold body 101′ andthe top sides 2501′ of the supporting bodies 251′, a gap is formedbetween the mold engaging surface 1011′ of the upper mold body 101′ andthe top sides 2501′ of the supporting bodies 251′. In addition, theenclosing film 104′ will provide a buffering effect at the mold engagingsurface 1011′ of the upper mold body 101′ to prevent the impact forcedirectly applying to the top sides 2501′ of the supporting bodies 251′,so as to prevent the impact force transmitting to the photosensitiveunits 21′, the circuit board 22′, and the lead wires 24′.

In addition, the enclosing film 104′ is removed from the mold 100′ afterthe mold sealer 23′ is formed during the molding process.

Referring to FIG. 21, the mold material, in liquid state, is introducedor injected into the mold 100′ to fill the mold cavities 103′ until themold cavities 103′ are fully filled with the mold material at thenon-photosensitive areas 213′ of the photosensitive units 21′ and partof the supporting bodies 251′, so as to prevent the mold materialfilling into the closed environment. In other words, the supportingbodies 251′ can block the mold material passing from thenon-photosensitive areas 213′ of the photosensitive units 21′ to theclosed environment and can block the mold material passing from the gapbetween the top sides 2501′ of the supporting bodies 251′ and the moldengaging surface 1011′ of the upper mold body 101′ to the closedenvironment.

It is worth mentioning that the mold material can be formed by fluidmaterial or solid particulate material, or a mixture of fluid materialand solid particulate material. It should not be limited to either oneof the liquid material or solid particulate material, and a mixture offluid material and solid particulate material in the present invention.When the mold material is filled into the mold cavities 103′, the moldmaterial is solidified to form the mold sealer 23′. In one embodiment,the mold material in liquid form is implemented as a thermoplasticmaterial, such as in a liquid state, wherein the mold material filledinto the mold cavities 103′ of the mold 100′ to form the mold sealer23′. It is worth mentioning that after the mold material is filled intothe mold cavities 103′ of the mold 100′, the solidification process,such as heating or cooling process, for solidifying the mold material toform the mold sealer 23′ should not be restricted in the presentinvention.

As shown in FIG. 22, when the mold material is filled into the moldcavities 103′, the supporting bodies 251′ will block the mold materialentering into the photosensitive areas 212′ of the photosensitive units21′, so as to form the mold sealer 23′ after the solidification of themold material. Once the mold sealer 23′ is formed, at least two opticalwindows 231′ are correspondingly formed, wherein the optical windows231′ are aligned with the photosensitive areas 212′ of thephotosensitive units 21′ and the optical lenses 10′ respectively.Therefore, a light channel is formed corresponding to the photosensitivearea 212′ of each of the photosensitive units 21′ and the respectiveoptical lens 10′ through the optical window 231′. Accordingly, the moldsealer 23′ is formed to have a main mold body 232′ covered at theperipheral portion 223′ of the circuit board 22′, and at least a portionof the outer lateral side 2503′ of each of the supporting bodies 251′,and the top side of each of the supporting bodies 251′. In other words,the mold sealer 23′ is constructed to have the main mold body 232′ andat least two optical windows 231′, wherein the light filters 40′ and thedrivers 30′ are then coupled to the top side of the mold sealer 23′ soas to retain the drivers 30′ corresponding to the optical lenses 10′along the photosensitive paths of the photosensitive units 21′respectively.

It is worth mentioning that the peripheral portion 223′ of the circuitboard 22′ is integrally bonded with the main mold body 232′ to enclosethe one or more electronic elements 26, such that the electronicelements 26 are individually enclosed by the main mold body 232′ so asto separate the electronic elements 26 from the photosensitive units21′. Through this configuration, the distance between two adjacentelectronic elements 26′ is reduced, and the mutual interference by theadjacent electronic elements 26′ can be avoided. The main mold body 232can further prevent the contamination generated from the electronicelements 26 to the photosensitive areas 212′ of the photosensitive units21′, so as to enhance the imaging quality of the array imaging module.

In addition, the electronic elements 26 are individually enclosed by themain mold body 232′ to prevent the mutual interference by the adjacentelectronic elements 26′, such that the distance between two adjacentelectronic elements 26′ is reduced. Even though the area of the circuitboard is reduced, more electronic elements 26′ can be electricallycoupled at the circuit board 22′ with a limited installing area toenhance the imaging quality of the array imaging module. In addition,the electronic elements 26 are individually enclosed by the main moldbody 232′. Even though the distance between the photosensitive unit 21′and the electronic elements 26′ is reduced, the main mold body 232′ canprevent the mutual interference between the photosensitive units 21′ andthe electronic elements 26′. Therefore, the photosensitive areas 212′ ofthe photosensitive units 21′ can be enlarged within the limited area ofthe circuit board 22′ to enhance the imaging quality of the arrayimaging module.

Preferably, the main mold body 232′ has a good heat insulation toprevent the heat generated from the photosensitive units 21′ during thephotoelectric conversion being transmitted to the electronic elements26′, so as enhance the reliability of the array imaging module duringthe operation thereof.

As shown in FIGS. 22 and 23, the light filters 40′ are coupled at thetop side of the mold sealer 23, such that the optical windows 231′ ofthe mold sealer 23′ are enclosed by the light filters 40′ respectively.Then, the light can pass through the optical lenses 10′ and can enterinto the interior of the array imaging module for being filtered by thelight filters 40′. The light filters 40′ can improve the imaging qualityof the array imaging module. As shown in FIG. 22, there are two lightfilters 40′ installed in the array imaging module. It is appreciatedthat the array imaging module can be constructed to have one lightfilter 40′ coupled at the top side of the mold sealer 23′ to enclose twooptical windows 231′ thereof. Therefore, two photosensitive areas 212′of the photosensitive units 21′ will be corresponded to the light filter40′ at different locations.

In addition, the top side of the mold sealer 23′ has at least two innerlateral top surfaces 233′ and an outer lateral top surface 234′ locatedat the same level of each of the inner lateral top surfaces 233′, suchthat the top side of the mold sealer 23′ has a flat surface. The lightfilters 40′ are coupled at the inner lateral top surfaces 233′ of themold sealer 23′ respectively to enclose the optical windows 231′respectively. The drivers 30 are coupled at the outer lateral topsurface 234′ of the mold sealer 23′ at different locations, so as toretain the light filters 40′ at a position between the drivers 30 andthe photosensitive areas 212′ of the photosensitive units 21′respectively. In another embodiment, the inner lateral top surface 233′of the molded base 23′ is located below the outer lateral top surface234′ thereof, such that due to the height difference, the inner lateraltop surface 233′ and the outer lateral top surface 233′ form astep-ladder configuration to form at least two indention slots 235′,wherein the light filters 40′ are coupled at the inner lateral topsurface 233′ within the indention slots 235′ respectively.

FIGS. 25 and 26 illustrate an alternative mode of the present invention,wherein the array imaging module further comprises a supporter 50′ whichhas at least two supporting cavities 51′. The two supporting cavities51′ are located at two lateral sides of the supporter 50′, such thateach of the supporting cavities 51′ forms a channel. The drivers 30′ arecoupled at the supporting cavities 51′ of the supporter 50′respectively, such that each of the drivers 30′ is stably retained inposition for ensuring the optical lens 10′ to be coaxially aligned withthe respective driver 30 and for increasing the strength of the arrayimaging module, so as to enhance the imaging quality of the arrayimaging module.

Preferably, after the drivers 30′ are coupled at the supporting cavities51′ of the supporter 50′ respectively, a filler is filled between anouter casing of each of the driver 30′ and an inner wall of thesupporter 50′ to ensure the drivers 30′ to be stably coupled at thesupporter 50′ so as to prevent any unwanted wobbling movement of thedrivers 30. Preferably, the filler can be adhesive filled between the anouter casing of each of the drivers 30′ and an inner wall of thesupporter 50′.

As shown in FIG. 25, after the drivers 30′ are coupled at the supportingcavities 51′ of the supporter 50′ respectively, the filler is filledbetween the outer casing of the driver 30′ and an inner wall of thesupporter 50′ to ensure the drivers 30′ to be stably coupled at thesupporter 50′ so as to prevent any unwanted wobbling movement of thedriver 30. The supporter 50′ will ensure the coaxial alignment betweenthe driver 30′ and the optical lens 10′ and will enhance the strength ofthe structure of the array imaging module so as to improve thestabilization of the array imaging module. It is worth mentioning thatthe drivers 30′ can be coupled at the supporting cavities 51′ of thesupporter 50′ respectively, such that at least a portion of the driver30′ will be enclosed by the supporter 50′. In another embodiment, atleast a portion of the mold sealer 23′ is enclosed by the supporter 50′,which should not be restricted in the present invention.

FIG. 28 illustrates another alternative mode of the array imaging moduleaccording to the present invention, wherein the array imaging modulecomprises two circuit boards 22′, wherein each of the circuit boards 22′has a chip coupling portion 222′ and a peripheral portion 223′. Thephotosensitive units 21′ are electrically coupled at the chip couplingportions 222′ of the circuit boards 22′ respectively. During the moldprocess to form the molded base 23′, the molded base 23′ comprises amain mold body 232′ coupled at the peripheral portion 223′ of each ofthe circuit boards 22′. In other words, the circuit boards 22′ can be asplit type circuit board.

FIG. 29 illustrates a third alternative mode of the array imaging moduleaccording to the present invention, wherein the array imaging modulecomprises a lens barrel 60′ and at least a driver 30′. The lens barrel60′ is integrally extended from the top side of the molded base 23′,wherein the driver 30 is coupled at the top side of the molded base 23′,such that the lens barrel 60′ and the molded base 23′ are respectivelyassembled with the optical lens 10′. Preferably, the lens barrel 60′ andthe molded base 23′ are formed integrally during the mold process. Forexample, the array imaging module is a dual lens camera module whichincorporates with one driver 30′ and one lens barrel 60′.

FIG. 30 illustrates a fourth alternative mode of the array imagingmodule according to the present invention, wherein the array imagingmodule comprises a lens barrel 60′ and at least a driver 30′. The lensbarrel 60′ and the driver 30′ are coupled at the top side of the moldedbase 23′. In other words, the lens barrel 60′ and the driver 30′ arecoupled at the top side of the molded base 23′ at different locations,wherein the optical lenses 10′ are coupled at the driver 30′ and thelens barrel 60′ respectively.

FIG. 31 illustrates a fifth alternative mode of the array imaging moduleaccording to the present invention, wherein the array imaging modulecomprises two lens barrels 60′ mounted to the top side of the moldedbase 23′. The optical lenses 10′ are coupled at the lens barrels 60′respectively. Preferably, the lens barrels 60′ are respectively coupledto the molded base 23′ in an integrated manner during the mold process.

FIG. 32 illustrates a sixth alternative mode of the array imaging moduleaccording to the present invention, wherein the array imaging modulecomprises two lens barrels 60′. After the molded photosensitive assembly20′ is formed, the lens barrels 60′ are coupled at the top side of themolded base 23′ at different positions. In other words, the opticallenses 10′ are coupled at the lens barrels 60′ respectively, such thatthe optical lenses 10′ are located along the optical paths of thephotosensitive units 21′ respectively. It is worth mentioning that thelens barrel 60′ can have the threaded structure or the thread-lessstructure, wherein the mounting structure of the lens barrel 60′ shouldnot be restricted.

FIGS. 31 and 32 illustrate two different alternative modes of the arrayimaging module according to the present invention. As shown in FIG. 33,the array imaging module comprises at least a lens barrel 60′ integrallyextended from the top side of the molded base 23′ during the moldprocess. Another lens barrel 60′ is coupled at the top side of themolded base 23′. For example, when the array imaging module is embodiedas the dual lens camera module, one of the lens barrel 60′ is integrallyextended from the top side of the molded base 23′ during the moldprocess and another lens barrel 60′ is coupled at the top side of themolded base 23′ for auto-focusing.

FIGS. 34 and 35A illustrate an eighth and a ninth alternative mode ofthe array imaging module according to the present invention, wherein thearray imaging module comprises at least a circuit board 22′ having atleast a receiving chamber 224′, wherein the photosensitive unit 21′ isreceived in the receiving chamber 224′ of the circuit board 22′ tominimize the height difference between the top side of thephotosensitive unit 21′ and the top side of the circuit board 22′.Preferably, the top side of the photosensitive unit 21′ and the top sideof the circuit board 22′ are aligned with the same planar direction.Therefore, the height of the array imaging module can be furtherreduced. The array imaging module can be incorporated with the thinnessof the electronic device. It is worth mentioning that the receivingchamber 224′ can be a receiving slot, as shown in FIG. 24. FIG. 35Aillustrates a ninth alternative mode of the array imaging moduleaccording to the present invention, wherein the receiving chamber 224′can be a receiving through hole for reducing the height of the arrayimaging module.

FIG. 35B illustrate a tenth alternative mode of the array imaging moduleaccording to the present invention, wherein the array imaging moduledoes not include the supporting member 25′. In particular, after thephotosensitive unit 21′ and the circuit board 22′ are electricallyconnected with each other, the photosensitive unit 21′ and the circuitboard 22′ are disposed in the mold 100′. The enclosing film 104′ isoverlappedly placed at the mold engaging surface 1011′ of the upper moldbody 101′, wherein the upper mold body 101′ is actuated to press themold engaging surface 1011′ of the upper mold body 101′ on thephotosensitive unit 21′, such that the enclosing film 104′ is sandwichedbetween the mold engaging surface 1011′ of the upper mold body 101′ andthe photosensitive unit 21′, so as to protect the photosensitive unit21′ during the molding process. Therefore, the manufacturing processwill be simplified to minimize the manufacturing cost of the arrayimaging module.

Once the molding process is completed, the mold sealer 23′ is formed todirectly enclose on the peripheral portion 223′ of the circuit board 22′and at least a portion of the non-photosensitive area 213′ of thephotosensitive unit 21′, such that the circuit board 22′, thephotosensitive unit 21′, and the mold sealer 23′ are integrally bondedwith each other.

FIG. 35B illustrate another alternative mode of the moldedphotosensitive assembly 20′ of the array imaging module according to thepresent invention, wherein the supporting body 251′ encloses a portionof the peripheral portion 223′ of the circuit board 22′ and thenon-photosensitive area 213′ of the photosensitive unit 21′ at the chipouter lateral side 2133′, the chip connecting portion 2132′, and atleast a portion of the chip inner lateral side 2131′. Once the moldingprocess is completed, the mold sealer 23′ is formed to enclose a portionof the peripheral portion 223′ of the circuit board 22′ and at least aportion of the outer lateral side 2503′ and the top side 2501′ of thesupporting body 251′.

It is worth mentioning that the entire lead wire 24′ is entirelyenclosed by the supporting body 251′, such that the lead wire 24′ isretained in position before the mold sealer 23′ is formed. During themolding process, the supporting body 251′ will prevent the mold materialcontacting with the lead wires 24′, so as to prevent the deformation ofthe lead wires 24′ during the introducing the mold material into themold cavities 103′. In addition, the supporting body 251′ has good heatinsulation ability to insulate the lead wires 24′ from the heatgenerated by the mold material in the mold cavities 103′ during thesolidification process, so as to ensure the electrical conductivity ofthe lead wires 24′.

In addition, each of the supporting bodies 251′ is formed at the portionof the peripheral portion 223′ of the circuit board 22′ and at least aportion of the non-photosensitive area 213′ of the respectivephotosensitive unit 21′ to ensure the electrical connection between thephotosensitive units 21′ and the circuit board 22′. During the moldingprocess, the supporting bodies 251′ will prevent the displacementbetween the photosensitive units 21′ and the circuit board 22′ and willensure the flatness of the photosensitive units 21′.

Furthermore, each of the supporting bodies 251′ is formed at the portionof the peripheral portion 223′ of the circuit board 22′ and at least aportion of the non-photosensitive area 213′ of the photosensitive unit21′ to prevent any clearance formed therebetween. During the moldingprocess, the supporting bodies 251′ will prevent the mold materialentering into the clearance between the peripheral portion 223′ of thecircuit board 22′ and the non-photosensitive areas 213′ of thephotosensitive units 21′ to ensure the photosensitive units 21′ beingflatten on the circuit board 22′ so as to enhance the imaging quality ofthe array imaging module.

FIG. 36B illustrates a second alternative mode of the moldedphotosensitive assembly 20′ of the array imaging module according to thepresent invention, wherein each of the supporting bodies 251′ encloses aportion of the peripheral portion 223′ of the circuit board 22′ and thenon-photosensitive area 213′ of the respective photosensitive unit 21′with at least a portion the chip outer lateral side 2133′ and the chipconnecting portion 2132′. Once the molding process is completed, themold sealer 23′ is formed to enclose a portion of the peripheral portion223′ of the circuit board 22′ and at least a portion of the outerlateral side 2503′ and the top sides 2501′ of the supporting bodies251′.

FIG. 36C illustrates a third alternative mode of the moldedphotosensitive assembly 20′ of the array imaging module according to thepresent invention, wherein each of the supporting bodies 251′ encloses aportion of the peripheral portion 223′ of the circuit board 22′ and thenon-photosensitive area 213′ of the respective photosensitive unit 21′with at least a portion the chip outer lateral side 2133′. Once themolding process is completed, the mold sealer 23′ is formed to enclose aportion of the peripheral portion 223′ of the circuit board 22′ and atleast a portion of the outer lateral side 2503′ and the top sides 2501′of the supporting bodies 251′.

It is appreciated that FIGS. 36B and 36C illustrate the moldedphotosensitive assembly 20′ two different alternatives, wherein thesupporting body 251′ does not have to enclose the chip inner lateralside 2131′ of the non-photosensitive area 213′ of the photosensitiveunit 21′, such that the size of the chip inner lateral side 2131′ of thephotosensitive unit 21′ can be further minimized. In other words, thephotosensitive area 212′ of the photosensitive unit 21′ can be furtherenlarged. As a result, the size of the array imaging module can beselectively controlled to enhance the imaging quality of the arrayimaging module.

In addition, the supporting body 251′ does not have to enclose the chipinner lateral side 2131′ of the non-photosensitive area 213′ of thephotosensitive unit 21′. During the solidification of adhesive to formthe supporting body 251′, the adhesive is located away from thephotosensitive area 212′ of the photosensitive unit 21′. In other words,before the solidification of adhesive, the adhesive may flow to the chipinner lateral side 2131′ of the photosensitive unit 21′ but not to thephotosensitive area 212′ of the photosensitive unit 21′, so as toprevent the contamination thereof. In other words, the chip innerlateral side 2131′ of the photosensitive unit 21′ provides a safetydistance between the supporting body 251′ and the photosensitive area212′ of the photosensitive unit 21′.

FIG. 36D illustrates a fourth alternative mode of the moldedphotosensitive assembly 20′ of the array imaging module according to thepresent invention, wherein each of the supporting bodies 251′ encloses aportion of the peripheral portion 223′ of the circuit board 22′. Oncethe molding process is completed, the main mold body 232′ of the moldsealer 23′ is formed to enclose a portion of the peripheral portion 223′of the circuit board 22′ and at least a portion of the outer lateralside 2503′ and the top sides 2501′ of the supporting bodies 251′.

FIG. 36D illustrates a fourth alternative mode of the moldedphotosensitive assembly 20′ of the array imaging module according to thepresent invention, wherein there is only one supporting member 25′. Thesupporting body 251′ of the supporting member 25′ encloses a portion ofthe peripheral portion 223′ of the circuit board 22′ to ensure thephotosensitive area 212′ of the respective photosensitive unit 21′ toalign with the through hole 252′ of the supporting member 25′. Once themolding process is completed, the main mold body 232′ of the mold sealer23′ is formed to enclose a portion of the peripheral portion 223′ of thecircuit board 22′ and at least a portion of the outer lateral side 2503′and the top side 2501′ of the supporting body 251′.

FIGS. 36D and 36E illustrate the molded photosensitive assembly 20′ twodifferent alternatives, wherein the supporting body 251′ does not haveto enclose the non-photosensitive area 213′ of the photosensitive unit21′, such that the supporting body 251′ is located away from thephotosensitive area 212′ of the photosensitive unit 21′ to prevent thecontamination of the photosensitive area 212′ of the photosensitive unit21′ during the solidification of adhesive to form the supporting body251′. Preferably, the supporting body 251′ further encloses theconnection between the lead wires 24′ and circuit connector 221′ of thecircuit board 22′ as shown in FIGS. 36D and 36E. During the moldingprocess, the supporting body 251′ will prevent the mold materialentering to the connection between the lead wires 24′ and circuitconnector 221′ of the circuit board 22′, so as to prevent thedisconnection or deformation of the lead wires 24′.

It is appreciated that FIGS. 36A to 36E illustrate different structuralconfigurations of the molded photosensitive assembly 20′, the moldedphotosensitive assembly 20′ can be further modified without anyrestriction. In other words, the supporting body 251′ can selectivelyenclose the circuit board outer lateral side 2233′, the circuit boardconnecting portion 2232′, and the circuit board inner lateral side 2231′of the circuit board 22′, and at least a portion or at least one of thecircuit board outer lateral side 2233′, the circuit board connectingportion 2232′, and the circuit board inner lateral side 2231′ of thephotosensitive unit 21. For example, the supporting body 251′ canenclose a portion of the circuit board connecting portion 2232′ or canentirely enclose the circuit board connecting portion 2232′. It isappreciated that the supporting body 251′ can be selectively modified toenclose different areas. In one embodiment, the supporting body 251′ canenclose different areas of the peripheral portion 223′ of the circuitboard 22′ and the non-photosensitive areas 213′ of the photosensitiveunits 21′.

FIG. 37 illustrates another alternative mode of the moldedphotosensitive assembly 20′ according to the present invention, whereinthe mold engaging surface 1011′ of the upper mold body 101′ is contactedwith at least a portion of the top sides 2501′ of the supporting bodies251′. Once the molding process is completed, the main mold body 232′ ofthe mold sealer 23′ is formed to enclose the portion of the top sides2501′ of the supporting bodies 251′.

It is worth mentioning that in one embodiment, the array imaging moduleis constructed to have at least two optical lenses 10′ and one moldedphotosensitive assembly 20′, wherein the optical lenses 10′ are coupledand located at the optical paths of the photosensitive units 21′ of themolded photosensitive assembly 20′.

FIG. 38 illustrates another embodiment of the array imaging moduleaccording to the present invention, which comprises at least two opticallenses 10′, a molded photosensitive assembly 20′, and at least anadditional photosensitive unit 21″. Each of the additionalphotosensitive units 21″ is operatively coupled at the circuit board 22′of the molded photosensitive assembly 20′, wherein the optical lenses10′ are located along the optical paths of the photosensitive unit 21′of molded photosensitive assembly 20′ and the additional photosensitiveunit 21″ respectively, so as to form the array imaging module. Inaddition, the array imaging module further comprises at least anadditional supporter 270″, at least an additional driver 30″, and/or atleast an additional lens barrel 60″. The additional supporters 270″ areelectrically coupled at the circuit board 22′ of the moldedphotosensitive assembly 20′. The additional drivers 30″ and/or the lensbarrels 60″ are coupled at the circuit board 22′. The optical lenses 10′are operatively coupled at one of the drivers 30′, the lens barrels 60″,the additional drivers 30″, and the additional lens barrels 60″. Then,the optical lenses 10′ are located along the optical paths of thephotosensitive unit 21′ of molded photosensitive assembly 20′ and theadditional photosensitive unit 21″ respectively. In addition, theadditional photosensitive unit 21″ is not coupled at the circuit board22′ of the molded photosensitive assembly 20′ but is coupled at anadditional circuit board 22″ of the array imaging module.

FIG. 39 illustrates an alternative mode of the array imaging moduleaccording to the present invention, wherein the light filters 40′ is notdirectly coupled to the main mold body 232′ of the mold sealer 23′ butat least a light filter supporter 70′. In other words, the light filters40′ are coupled to the light filter supporter 70′ respectively, whereinthe light filter supporter 70′ is coupled at the top side of the mainmold body 232′ to retain the light filters 40′ between the opticallenses 10′ and the photosensitive units 21′ respectively. Through thisconfiguration, the size of the light filter 40′ can be reduced to reducethe manufacturing cost of the array imaging module.

It is worth mentioning that the number of light filter supporter 70′matches with the number of light filter 40′, such that the light filtersupporter 70′ and the light filter 40′ are set in a one-to-one manner.For example, when one light filter 40′ is used, only one light filtersupporter 70′ is needed for the light filter 40′. In another embodiment,the number of light filter supporter 70′ matches with the number oflight filter 40′ which matches with the number of the optical lens 10′.For example, in FIG. 24, the number of light filter supporter 70′, thenumber of light filter 40′, the number of the optical lens 10′ are two,such that two light filter supporters 70′, two light filters 40′, andtwo optical lenses 10′ are used.

In another embodiment, the number of light filter supporter 70′ isdifferent from the number of light filter 40′. For example, when onelight filter supporter 70′ is used, two or more of the light filters 40′can be incorporated. In particular, the light filters 40′ can besupported at different locations of the light filter supporter 70′.

As shown in FIG. 39, the top side of the main mold body 232′ of the moldsealer 23′ is a flat surface, wherein after the mold sealer 23′ isformed, the light filter supporter 70′ is coupled on the top side of themain mold body 232′, and then the driver 30′ or the lens barrel 60′ iscoupled at the light filter supporter 70′. In other words, the driver30′ or the lens barrel 60′ is not directly coupled at the top side ofthe main mold body 232′ but is coupled at the light filter supporter70′.

FIG. 40 illustrates another alternative mode of the array imagingmodule, wherein the mold sealer 23′ further has an indention groove 235′indentedly formed at the top side of the main mold body 232′. The lightfilter supporter 70′ is engaged with and received in the indentiongroove 235′ to minimize the height of the array imaging module.Accordingly, the driver 30′ or the lens barrel 60′ can be directlycoupled at the top side of the main mold body 232′.

It is appreciated that the optical lens 10′ can be directly coupled atthe top side of the main mold body 232′ or directly coupled at the topside of the light filter supporter 70′.

FIG. 41 illustrates another alternative mode of the array imagingmodule, wherein there is only one light filter supporter 70′ and thelight filter supporter 70′ has at least two light through slots. Two ormore light filters 40′ can be coupled to the light filter supporter 70′at a position that the light through slots are aligned with the lightfilters 40′ respectively. Through this configuration, the manufacturingprocess will be simplified to reduce the manufacturing cost of the arrayimaging module. Preferably, the light filter supporter 70′ is receivedin the indention groove 235′ of the main mold body 232′ to furtherreduce the size of the array imaging module. Therefore, the structure ofthe array imaging module will be more compact.

FIG. 42 illustrates another alternative mode of the array imaging moduleaccording to the present invention, which comprises at least two drivers30 which are integrally formed with a motor carrier 31. For example, thearray imaging module comprises two drivers 30, the drivers 30 areintegrally formed with the motor carrier 31, such that the drivers 30can be easily coupled at the top side of the main mold body 23 tominimize a distance between the driver 30 and the optical lens 10, so asto have a compact structure of the array imaging module.

As shown in FIG. 43, the present invention provides an electronic devicebuilt-in with the array imaging module. The electronic device comprisesa device body 200′ with a device processor therein, wherein the arrayimaging module is mounted at the device body 200′ to operatively link tothe device processor therein for capturing image.

In another embodiment, the present invention further provides amanufacturing process of the molded photosensitive assembly 20 whichcomprises the following steps.

(a) Electrically connect at least two photosensitive units 21′ to atleast one circuit board 22′ via at least a lead wire 24′.

(b) Dispose the photosensitive units 21′ and the circuit board 22′ inone of the upper mold body 101′ and the lower mold body 102′ of a mold100′.

(c) During the coupling of the upper mold body 101′ and the lower moldbody 102′ with each other to close the mold 100′, retain the moldengaging surface 1011′ of the upper mold body 101′ by at least asupporting member 25′ to prevent the lead wire 24′ being pressed by themold engaging surface 1011′ of the upper mold body 101′.

(d) Form at least a mold cavity 103′ between the upper mold body 101′and the lower mold body 102′, and introduce a mold material into themold cavity 103′, wherein the mold material forms a mold sealer 23′after it is solidified. The mold sealer 23′ comprises a main mold body232′ and has at least two optical windows 231′. The main mold body 232′is formed to cover at and bond with at least a portion of the peripheralportion 223′ of the circuit board 22′ and at least a portion of thesupporting member 25′. The photosensitive areas 212′ of thephotosensitive units 21′ are aligned with the optical windows 231′respectively.

One skilled in the art will understand that the embodiment of thepresent invention as shown in the drawings and described above isexemplary only and not intended to be limiting.

It will thus be seen that the objects of the present invention have beenfully and effectively accomplished. The embodiments have been shown anddescribed for the purposes of illustrating the functional and structuralprinciples of the present invention and is subject to change withoutdeparture from such principles. Therefore, this invention includes allmodifications encompassed within the spirit and scope of the followingclaims.

1-21. (canceled)
 22. A manufacturing method of a molded photosensitiveassembly of an array imaging module including at least two opticallenses, comprising: providing at least a circuit board having one ormore electronic elements and one or more connecting elementselectrically coupled at said circuit board; providing at least twophotosensitive units electrically coupled at said circuit board, whereineach of said photosensitive units has a photosensitive area and anon-photosensitive area encircling said photosensitive area, whereinsaid one or more connecting element electrically connect saidnon-photosensitive area to said circuit board; providing an enclosingfilm at a mold engaging surface of said circuit board that issubstantially the surface being molded; molding a molded base tointegrally enclose, package and seal said circuit board and saidnon-photosensitive area, to integrally and sealedly embed and enclosesaid one or more electronic elements and said one or more connectingelements therein to form an integrated body, wherein when a first moldbody and a second mold body are coupled with each other in a moldclosing state, said enclosing film is sandwiched between said moldengaging surface of said first mold body and said circuit board toprevent said first mold body from direct contacting with said circuitboard so as to provide a buffering and sealing effect between said moldengaging surface and said circuit board to ensure a sealing engagementthat prevents a fluid state mold material flowing to said coupling areasof said circuit board and ensures a flatness of said coupling areas ofsaid circuit board, and wherein said molded base has at least twooptical windows formed therein to communicate and align with said atleast two photosensitive units respectively to define at least twophotosensitive paths for said at least two photosensitive unitsrespectively, wherein each of said optical windows is configured to havea tapered size that a cross section of said optical window is graduallyincreased from said photosensitive area of said photosensitive unit,such that an inner wall of said optical window is slanted and isextended from said photosensitive unit, wherein said at least twooptical windows form at least two light channels through saidphotosensitive units and the optical lenses respectively; and providingat least one light filter to be coupled at a top side of said moldedbase and positioned above said light window and said photosensitiveunit, wherein said light filter, said molded base and said circuit boardform a sealed enclosure for said photosensitive unit.
 23. Themanufacturing method according to claim 22, wherein the method furthercomprises a step of electrically connecting the photosensitive units tothe circuit board via at least a lead wire.
 24. The manufacturing methodaccording to claim 22, wherein the molding step further comprises a stepof enclosing the lead wire by the molded base.
 25. The manufacturingmethod according to claim 22, wherein the method further comprises astep of forming at least a coupling slot at a top side of the moldedbase for engaging with a supporter, optical lenses, or drivers.
 26. Themanufacturing method according to claim 22, wherein the method furthercomprises a step of forming a step-like platform that upwardly extendsfrom an inner side of the molded base for spacedly supporting the lightfilters and the optical lenses in position, so that said molded basecomprises an enclosing portion, a light filter mounting portion and alens mounting portion, wherein said enclosing portion is integrallymolded at said circuit board and said non-photosensitive area tointegrally and sealedly embed and enclose said one or more electronicelements and said one or more connecting elements therein, wherein saidlight filter mounting portion and said lens mounting portion areextended integrally and upwardly from said enclosing portion to form astep-like platform to stably support said at least one light filter andthe at least two optical lenses, wherein said lens mounting portion hasat least two lens inner wall which are flat surfaces for coupling withthe at least two optical lenses respectively.
 27. The manufacturingmethod according to claim 22, wherein the molding step further comprisesa step of forming a threaded structure at an inner wall of the moldedbase for coupling with the optical lenses with a corresponding threadedconfiguration.
 28. The manufacturing method according to claim 22,wherein before the molding step, the method further comprises a step offorming at least a reinforcing slot, which is an indention cavity, atthe circuit board, wherein the molded base is extended into thereinforcing slot to enhance the strength of the circuit board.
 29. Themanufacturing method according to claim 22, wherein the method furthercomprises a step of forming at least a reinforcing slot, which is athrough slot, at the circuit board, wherein the molded base is extendedinto the reinforcing slot to enhance the strength of the circuit board.30. The manufacturing method according to claim 22, wherein before themolding step, the method further comprises a step of forming at least areinforcing layer overlapped and connected to the circuit board toreinforce the strength of the circuit board.
 31. The manufacturingmethod according to claim 22, wherein the molding step further comprisesa step of forming a shielding layer that encloses the circuit board andthe molded base to enhance the strength of the circuit board and toprevent any electromagnetic interference of the molded photosensitiveassembly.
 32. The manufacturing method according to claim 22, whereinthe molding step further comprises a step of pre-setting a plurality ofconnecting wires in the molded base that are electrically connected tothe circuit board for electrically connecting with the driversrespectively.
 33. The manufacturing method according to claim 22,wherein the molding step further comprises a step of pre-setting aplurality of terminal slots at the top side of the molded base forenabling the driver connecting terminals of the connecting wiresexposing at the terminal slots respectively.
 34. The manufacturingmethod according to claim 22, wherein the molding step further comprisesa step of pre-setting a plurality of terminal slots in the molded baseand a plurality of circuit terminals at the circuit board and extendedto expose at the terminal slots respectively for the driver connectingterminals of the drivers inserted into the terminal slots to connectwith the circuit terminals respectively.
 35. The manufacturing methodaccording to claim 22, wherein the molding step further comprises a stepof pre-setting a plurality of engraving circuits electrically connectedto the circuit board, wherein the engraving circuits are embedded in themolded base for electrically connecting with the drivers respectively.36. The manufacturing method according to claim 35, wherein theengraving circuit is formed by Laser Direct Structuring (LDS) to beembedded in the molded base.